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NXP Semiconductors SPC5517EBMLQ66 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 1.5MB FLASH 144LQFP

50,731 ActiveNXP Semiconductors144-LQFPRoHS
SPC5517EBMLQ66 144-LQFP package illustration

Same model may have multiple batches, images only for reference.

SPC5517EBMLQ66
Manufacturer
Part Number (MPN)
SPC5517EBMLQ66
Detailed Description
IC MCU 32BIT 1.5MB FLASH 144LQFP
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF SPC5517EBMLQ66 Datasheet
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Technical Specifications

NXP Semiconductors SPC5517EBMLQ66 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
80K x 8
RoHS
Yes
Package / Case
144-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
4.5V ~ 5.25V
Lifecycle Status
Active
Peripherals
DMA, POR, PWM, WDT
Number of I/O
111
Speed
66MHz

Related Parts Comparison (SPC5517EBMLQ66 vs SPC5643LF2MLQ8 vs SPC5633MF2MLQ60R vs MC68EN302AG20BT)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case144-LQFP144-LQFP144-LQFP144-LQFP
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)0°C ~ 70°C (TA)
Core Processore200z0, e200z1e200z4e200z3M68000
Lifecycle StatusActiveActiveActiveObsolete
Speed66MHz80MHz60MHz20MHz
Mounting TypeSurface MountSurface MountSurface Mount--
Supply Voltage4.5V ~ 5.25V3V ~ 5.5V4.5V ~ 5.25V--
Core Size32-Bit Dual-Core32-Bit Dual-Core32-Bit Single-Core--
RAM Size80K x 8128K x 864K x 8--
ConnectivityCANbus, EBI/EMI, I²C, SCI, SPICANbus, FlexRay, LINbus, SPI, UART/USARTCANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART--
Data ConvertersA/D 40x12bA/D 32x12bA/D 32x12b--
Oscillator TypeInternalInternalInternal--
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