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NXP Semiconductors MMC2107CFCAG33 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 128KB FLASH 144LQFP

54,709NXP Semiconductors144-LQFPRoHS
MMC2107CFCAG33 - No Image Available

Same model may have multiple batches, images only for reference.

MMC2107CFCAG33
Manufacturer
Part Number (MPN)
MMC2107CFCAG33
Detailed Description
IC MCU 32BIT 128KB FLASH 144LQFP
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MMC2107CFCAG33 Datasheet
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Technical Specifications

NXP Semiconductors MMC2107CFCAG33 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
8K x 8
Package / Case
144-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 3.6V
Peripherals
POR, PWM, WDT
Number of I/O
72
Speed
33MHz
Core Processor
M210
Program Memory Type
Flash

Alternate Parts Comparison (MMC2107CFCAG33 vs MC68EN302AG20BT vs SPC5643LF2MLQ8 vs SCF5250CAG120R2)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case144-LQFP144-LQFP144-LQFP144-LQFP
Operating Temperature-40°C ~ 85°C (TA)0°C ~ 70°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)
Core ProcessorM210M68000e200z4Coldfire V2
Speed33MHz20MHz80MHz120MHz
Mounting TypeSurface Mount--Surface MountSurface Mount
Supply Voltage2.7V ~ 3.6V--3V ~ 5.5V1.08V ~ 1.32V
Core Size16/32-Bit--32-Bit Dual-Core32-Bit Single-Core
RAM Size8K x 8--128K x 8128K x 8
ConnectivityEBI/EMI, SCI, SPI--CANbus, FlexRay, LINbus, SPI, UART/USARTEBI/EMI, I²C, IDE, Memory Card, SPI, UART/USART
Data ConvertersA/D 8x10b--A/D 32x12bA/D 6x12b
Oscillator TypeInternal--InternalInternal
PeripheralsPOR, PWM, WDT--DMA, POR, PWM, WDTDMA, I²S, POR, Serial Audio, WDT
Action

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