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NXP Semiconductors LPC1812JBD144E Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 512KB FLASH 144LQFP

16,315 ActiveNXP Semiconductors144-LQFPRoHS
LPC1812JBD144E 144-LQFP package illustration

Same model may have multiple batches, images only for reference.

LPC1812JBD144E
Manufacturer
Part Number (MPN)
LPC1812JBD144E
Detailed Description
IC MCU 32BIT 512KB FLASH 144LQFP
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF LPC1812JBD144E Datasheet
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Technical Specifications

NXP Semiconductors LPC1812JBD144E Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
LPC181x
RAM Size
104K x 8
Data Bus Width
32 bit
Maximum Clock Frequency
180 MHz
RoHS
Yes
Package / Case
144-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.2V ~ 3.6V
Lifecycle Status
Active

Alternate Parts Comparison (LPC1812JBD144E vs MC68EN302AG20BT vs SPC5643LF2MLQ8 vs SCF5250CAG120R2)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case144-LQFP144-LQFP144-LQFP144-LQFP
Operating Temperature-40°C ~ 105°C (TA)0°C ~ 70°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)
Core ProcessorARM® Cortex®-M3M68000e200z4Coldfire V2
Lifecycle StatusActiveObsoleteActiveNot For New Designs
Speed180MHz20MHz80MHz120MHz
Mounting TypeSurface Mount--Surface MountSurface Mount
Supply Voltage2.2V ~ 3.6V--3V ~ 5.5V1.08V ~ 1.32V
Core Size32-Bit Single-Core--32-Bit Dual-Core32-Bit Single-Core
RAM Size104K x 8--128K x 8128K x 8
RoHSYesYes--Yes
ConnectivityCANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART--CANbus, FlexRay, LINbus, SPI, UART/USARTEBI/EMI, I²C, IDE, Memory Card, SPI, UART/USART
Data ConvertersA/D 8x10b; D/A 1x10b--A/D 32x12bA/D 6x12b
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