Skip to main content

DRAM

DRAM (Dynamic Random-Access Memory) provides high-density, high-bandwidth volatile storage for computing systems, display buffers, and network packet processing. This category covers SDR, DDR, DDR2, DDR3, DDR4, DDR5, LPDDR, and Mobile SDRAM ICs from Micron, Samsung, Alliance Memory, ISSI, and Intelligent Memory.

Request Quote
6,150+Products
10+Manufacturers
100%Original & New
GlobalDelivery

Browse DRAM Products

Showing 181–190 of 6,150 products
PART NUMBERMANUFACTURERDESCRIPTIONSTOCKQTY / ACTION
K4B2G0446C-HCH9Samsung SemiconductorNumber of Pins: 78 | Max Operating Temp: 85 | Min Operating Temp: 0 | Terminal Position: BOTTOM | Jedec Package Code: R-PBGA-B78 | Temperature Grade: OTHER109
K4B4G0846B-HYH9Samsung SemiconductorNumber of Pins: 78 | Terminal Position: BOTTOM | Jedec Package Code: R-PBGA-B78 | Width: 10 | Length: 11 | Number of Functions: 199
K4T51083QC-ZCD5000Samsung SemiconductorPackage / Case: FBGA | Mounting Type: Surface Mount | Access Time Max: 0.5ns | Address Bus Width: 15b | Density: 512Mb | Max Frequency: 533MHzIn Stock
K4T51163QI-HIE7Samsung SemiconductorPackage / Case: FBGA | Mounting Type: Surface Mount | Number of Pins: 84 | Organization: 32Mx16In Stock
K4B8G1646Q-MCK0Samsung SemiconductorNumber of Pins: 96 | Max Operating Temp: 85 | Min Operating Temp: 0 | Terminal Position: BOTTOM | Jedec Package Code: R-PBGA-B96 | Temperature Grade: OTHERIn Stock
K4B1G0446F-HCF8Samsung SemiconductorNumber of Pins: 78 | Terminal Position: BOTTOM | Jedec Package Code: R-PBGA-B78 | Supply Voltage Nom Vsup: 1.5 | Supply Current Max: 0.14 | Number of Words: 2684354561,588
K4T51163QI-HIE6Samsung SemiconductorPackage / Case: FBGA | Mounting Type: Surface Mount | Number of Pins: 84 | Organization: 32Mx161,853
K4T1G164QG-BCE6T00Samsung SemiconductorSupply Voltage: 1.8V | Organization: 64M x 16 | Density: 1Gb | Max Frequency: 333MHz | RoHS: CompliantIn Stock
K4T1G164QQ-HCE6000Samsung SemiconductorPackage / Case: FBGA | Mounting Type: Surface Mount | Supply Voltage: 1.8V | Organization: 64MX1615,030
K4T51163QC-ZCE7Samsung SemiconductorNumber of Pins: 84 | Max Operating Temp: 95 | Min Operating Temp: 0 | Terminal Position: BOTTOM | Jedec Package Code: R-PBGA-B84 | Temperature Grade: OTHERIn Stock

How to Choose DRAM

A practical selection framework for DRAM covering specifications, packaging, lifecycle, and sourcing on Octatronics.

  1. Define electrical and environmental requirements

    Start with the required function and operating conditions for DRAM, then lock in critical parameters such as function, supply voltage, interface, package, and temperature grade. Match these against datasheet limits, not catalog summaries alone.

  2. Validate package and land pattern compatibility

    Confirm the DRAM package matches your PCB footprint, pick-and-place constraints, and moisture sensitivity handling. Verify reel/tape or tube packaging for production.

  3. Check lifecycle, compliance, and alternates

    Review lifecycle status (Active, NRND, EOL), RoHS, and approved alternate sources for DRAM before committing to high-volume builds. Use Octatronics cross-reference data when a drop-in replacement is needed.

  4. Compare manufacturers and request pricing

    Filter DRAM by manufacturers such as ROHM and Renesas, compare key specs side by side, then submit an RFQ with quantity, target delivery, and traceability requirements.

About DRAM

Frequently Asked Questions

Octatronics can help source a wide range of DRAM from major manufacturers worldwide, including active production parts, long-lead-time items, and hard-to-find components.

Yes. You can submit a single part number or upload a BOM with multiple parts. Our team will check stock, date code, lead time, and pricing for each item.

Availability depends on the specific part number and supplier source. For important orders, buyers can request packaging photos, labels, date code information, and traceability documents.

Yes. Octatronics supports sourcing for active, end-of-life, obsolete, and hard-to-find components through our global supplier network.

Please provide the part number, manufacturer, quantity, required date code, target price, delivery country, and whether original packaging or COC is required.

Articles & Technology

View All →
How to Choose Electronic Components for Reliable Hardware Design

How to Choose Electronic Components for Reliable Hardware Design

Learn how to choose electronic components for reliable hardware design, including specifications, lifecycle status, sourcing risks, quality checks, and BOM optimization.

Pin-to-Pin Replacement Parts: How to Check Compatibility Before Sourcing

When an original electronic component becomes obsolete, unavailable, or too expensive, a pin-to-pin replacement part can help avoid PCB redesign and keep production or repair projects moving. However, pin-to-pin compatibility does not automatically mean the part is a safe drop-in replacement. This guide explains how to check package, footprint, pinout, electrical ratings, thermal performance, timing behavior, firmware requirements, compliance status, and lifecycle risk before sourcing replacement parts. It also provides a practical checklist to help engineers, buyers, and maintenance teams reduce sourcing mistakes and verify compatibility before purchase.

How to Find Pin-Compatible Alternatives for Obsolete ICs

Finding a pin-compatible alternative for an obsolete IC is not just about matching the package. It requires a structured review of pinout, footprint, electrical parameters, functional behavior, lifecycle status, sourcing reliability, and sample validation.

DDR6 RAM: What We Know So Far About Next-Generation Memory

DDR6 RAM is the next planned generation of DDR memory technology after DDR5, designed to support higher bandwidth, improved efficiency, and future computing platforms with greater data movement requirements. Although DDR6 is not yet a mainstream commercial product, major memory manufacturers and platform developers are already preparing for the next stage of DRAM evolution.