DRAM
DRAM (Dynamic Random-Access Memory) provides high-density, high-bandwidth volatile storage for computing systems, display buffers, and network packet processing. This category covers SDR, DDR, DDR2, DDR3, DDR4, DDR5, LPDDR, and Mobile SDRAM ICs from Micron, Samsung, Alliance Memory, ISSI, and Intelligent Memory.
Browse DRAM Products
| PART NUMBER | MANUFACTURER | DESCRIPTION | STOCK | QTY / ACTION |
|---|---|---|---|---|
| K4H561638F-TCA2 | Samsung Semiconductor | Package / Case: TSOP | Mounting Type: Surface Mount | Access Time Max: 0.75ns | Address Bus Width: 15b | Density: 256Mb | Max Frequency: 266MHz | In Stock | |
| K4H510838G-HCB3 | Samsung Semiconductor | Package / Case: FBGA | Mounting Type: Surface Mount | Number of Pins: 60 | Organization: 64Mx8 | In Stock | |
| K4F151611C-TC60 | Samsung Semiconductor | Number of Pins: 44 | Max Operating Temp: 70 | Min Operating Temp: 0 | Terminal Position: DUAL | Jedec Package Code: R-PDSO-G44 | Width: 10.16 | In Stock | |
| K4H510838F-LCB3 | Samsung Semiconductor | Number of Pins: 66 | Terminal Position: DUAL | Jedec Package Code: R-PDSO-G66 | Width: 10.16 | Length: 22.22 | Number of Functions: 1 | In Stock | |
| K4X1G323PD-8GC3 | Samsung Semiconductor | Package / Case: FBGA | Supply Voltage: 1.8V | Density: 1Gb | RoHS: Compliant | In Stock | |
| K4F170411D-BC60 | Samsung Semiconductor | Number of Pins: 24 | Max Operating Temp: 70 | Min Operating Temp: 0 | Terminal Position: DUAL | Jedec Package Code: R-PDSO-J24 | Width: 7.62 | In Stock | |
| KM44S32030AT-GL | Samsung Semiconductor | Number of Pins: 54 | Max Operating Temp: 70 | Min Operating Temp: 0 | Terminal Position: DUAL | Jedec Package Code: R-PDSO-G54 | Width: 10.16 | In Stock | |
| K4H510438G-HCB3 | Samsung Semiconductor | Package / Case: FBGA | Mounting Type: Surface Mount | Number of Pins: 60 | Organization: 128Mx4 | In Stock | |
| K4W2G1646E-BC11 | Samsung Semiconductor | Number of Pins: 96 | Max Operating Temp: 85 | Min Operating Temp: 0 | Terminal Position: BOTTOM | Jedec Package Code: R-PBGA-B96 | Temperature Grade: OTHER | 1,122 | |
| K4J10324KE-HC14 | Samsung Semiconductor | Package / Case: FBGA | Mounting Type: Surface Mount | Number of Pins: 136 | Organization: 32Mx32 | In Stock |
How to Choose DRAM
A practical selection framework for DRAM covering specifications, packaging, lifecycle, and sourcing on Octatronics.
Define electrical and environmental requirements
Start with the required function and operating conditions for DRAM, then lock in critical parameters such as function, supply voltage, interface, package, and temperature grade. Match these against datasheet limits, not catalog summaries alone.
Validate package and land pattern compatibility
Confirm the DRAM package matches your PCB footprint, pick-and-place constraints, and moisture sensitivity handling. Verify reel/tape or tube packaging for production.
Check lifecycle, compliance, and alternates
Review lifecycle status (Active, NRND, EOL), RoHS, and approved alternate sources for DRAM before committing to high-volume builds. Use Octatronics cross-reference data when a drop-in replacement is needed.
Compare manufacturers and request pricing
Filter DRAM by manufacturers such as ROHM and Renesas, compare key specs side by side, then submit an RFQ with quantity, target delivery, and traceability requirements.
Related Selection Resources
Top DRAM Manufacturers
ROHM
ROHM DRAM products are available for part-number review, stock checks, and RFQ support.
3,980 productsRenesas
Renesas DRAM products are available for part-number review, stock checks, and RFQ support.
74,605 productsWinbond Electronics
Winbond Electronics DRAM products are available for part-number review, stock checks, and RFQ support.
1,681 productsISSI®
ISSI® DRAM products are available for part-number review, stock checks, and RFQ support.
5,109 productsAlliance Memory
Alliance Memory DRAM products are available for part-number review, stock checks, and RFQ support.
1,536 productsMacronix
Macronix DRAM products are available for part-number review, stock checks, and RFQ support.
927 productsMicron Technology Inc.
Micron Technology Inc. DRAM products are available for part-number review, stock checks, and RFQ support.
3,916 productsIntelligent Memory Ltd.
Intelligent Memory Ltd. DRAM products are available for part-number review, stock checks, and RFQ support.
66 products
Infineon Technologies
Infineon Technologies DRAM products are available for part-number review, stock checks, and RFQ support.
20,310 products
Microchip Technology
Microchip Technology DRAM products are available for part-number review, stock checks, and RFQ support.
67,462 productsAbout DRAM
Frequently Asked Questions
Octatronics can help source a wide range of DRAM from major manufacturers worldwide, including active production parts, long-lead-time items, and hard-to-find components.
Yes. You can submit a single part number or upload a BOM with multiple parts. Our team will check stock, date code, lead time, and pricing for each item.
Availability depends on the specific part number and supplier source. For important orders, buyers can request packaging photos, labels, date code information, and traceability documents.
Yes. Octatronics supports sourcing for active, end-of-life, obsolete, and hard-to-find components through our global supplier network.
Please provide the part number, manufacturer, quantity, required date code, target price, delivery country, and whether original packaging or COC is required.
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When an original electronic component becomes obsolete, unavailable, or too expensive, a pin-to-pin replacement part can help avoid PCB redesign and keep production or repair projects moving. However, pin-to-pin compatibility does not automatically mean the part is a safe drop-in replacement. This guide explains how to check package, footprint, pinout, electrical ratings, thermal performance, timing behavior, firmware requirements, compliance status, and lifecycle risk before sourcing replacement parts. It also provides a practical checklist to help engineers, buyers, and maintenance teams reduce sourcing mistakes and verify compatibility before purchase.
How to Find Pin-Compatible Alternatives for Obsolete ICs
Finding a pin-compatible alternative for an obsolete IC is not just about matching the package. It requires a structured review of pinout, footprint, electrical parameters, functional behavior, lifecycle status, sourcing reliability, and sample validation.
DDR6 RAM: What We Know So Far About Next-Generation Memory
DDR6 RAM is the next planned generation of DDR memory technology after DDR5, designed to support higher bandwidth, improved efficiency, and future computing platforms with greater data movement requirements. Although DDR6 is not yet a mainstream commercial product, major memory manufacturers and platform developers are already preparing for the next stage of DRAM evolution.