Winbond Electronics W987D6HBGX6I DRAM
DRAM Memory IC 128Mbit Parallel 166 MHz 1.7V ~ 1.95V 54-VFBGA (8x9)
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W987D6HBGX6I
Detailed Description
IC DRAM 128MBIT PAR 54VFBGA
Package
54-VFBGA (8x9)
Lifecycle Status
Last Time Buy
RoHS State
RoHS Compliant
Datasheet
W987D6HBGX6I Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W987D6HBGX6I DRAM technical specifications.
General
Memory Size
128 Mbit
RoHS
ROHS3 Compliant
Package / Case
54-TFBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.7V ~ 1.95V
Lifecycle Status
Last Time Buy
Max Frequency
166 MHz
Memory Type
Volatile
Alternate Parts Comparison (W987D6HBGX6I vs W9825G6KH-6 vs W988D6FBGX7E vs W9464G6KH-5)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | 0 ~ 70 | -25°C ~ 85°C (TC) | 0°C ~ 70°C (TA) |
| Supply Voltage | 1.7V ~ 1.95V | 3 ~ 3.6 | 1.7V ~ 1.95V | 2.3V ~ 2.7V |
| Memory Size | 128 Mbit | 256M | 256Mb (16M x 16) | 64M |
| Package / Case | 54-TFBGA | -- | 54-TFBGA | 66-TSSOP |
| RoHS | ROHS3 Compliant | Compliant | -- | Compliant |
| Lifecycle Status | Last Time Buy | Active | Last Time Buy | Active |
| Access Time | 5.4 ns | -- | 5.4ns | 55 ns |
| Max Frequency | 166 MHz | -- | 133MHz | 200 MHz |
| Memory Format | DRAM | -- | DRAM | DRAM |
| Memory Interface | Parallel | -- | Parallel | Parallel |
| Memory Type | Volatile | -- | Volatile | Volatile |
| Action |
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