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Winbond Electronics W66CQ2NQUAHJ DRAM

DRAM Memory IC 4G LVSTL_11 2.133 GHz 1.06V ~ 1.17V, 1.7V ~ 1.95V 200-WFBGA (10x14.5)

In Stock ActiveWinbond ElectronicsBGARoHS
W66CQ2NQUAHJ BGA package illustration

Same model may have multiple batches, images only for reference.

W66CQ2NQUAHJ
Part Number (MPN)
W66CQ2NQUAHJ
Detailed Description
IC DRAM 4GBIT LVSTL 11 200WFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF W66CQ2NQUAHJ Datasheet
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Technical Specifications

Winbond Electronics W66CQ2NQUAHJ DRAM technical specifications.

General

Interface
LVSTL_11
Memory Size
4G
Data Bus Width
32
Maximum Clock Frequency
4267
RoHS
Compliant
Number of Pins
200
Package / Case
200-WFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TC)
Supply Voltage
1.06V ~ 1.17V, 1.7V ~ 1.95V

Related Parts Comparison (W66CQ2NQUAHJ vs W634GU6RB-11 vs W9751G6NB-25 vs W9751G6NB25I)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TC)0 ~ 950 ~ 85-40 ~ 95
Supply Voltage1.06V ~ 1.17V, 1.7V ~ 1.95V1.283 ~ 1.451.7 ~ 1.91.7 ~ 1.9
Memory Size4G4G512M512M
Maximum Clock Frequency42671866800800
Data Bus Width32161616
Number of Pins200968484
RoHSCompliantCompliantCompliantCompliant
Lifecycle StatusActiveActiveActiveActive
Address Bus Width Bit17181515
AutomotiveNoNoNoNo
Dram TypeMobile LPDDR4X SDRAMDDR3L SDRAMDDR2 SDRAMDDR2 SDRAM
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