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Winbond Electronics W978H6KBVX2E DRAM

DRAM Memory IC 256M Parallel 400 MHz 1.14V ~ 1.95V 134-VFBGA (10x11.5)

8,000Winbond ElectronicsBGA$4.79RoHS
W978H6KBVX2E BGA package illustration

Same model may have multiple batches, images only for reference.

W978H6KBVX2E
Part Number (MPN)
W978H6KBVX2E
Detailed Description
IC DRAM 256MBIT PAR 134VFBGA
Package
BGA
Lifecycle Status
Not For New Designs
RoHS State
RoHS Compliant
Datasheet
PDF W978H6KBVX2E Datasheet
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Technical Specifications

Winbond Electronics W978H6KBVX2E DRAM technical specifications.

General

Interface
HSUL_12
Memory Size
256M
Data Bus Width
16
Maximum Clock Frequency
400
RoHS
Compliant
Number of Pins
134
Package / Case
134-VFBGA
Mounting Type
Surface Mount
Operating Temperature
-25°C ~ 85°C (TC)
Supply Voltage
1.14V ~ 1.95V

Alternate Parts Comparison (W978H6KBVX2E vs W634GU6RB-11 vs W634GU6MB-12 vs W9751G6NB-25)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-25°C ~ 85°C (TC)0 ~ 950 ~ 950 ~ 85
Supply Voltage1.14V ~ 1.95V1.283 ~ 1.451.283 ~ 1.451.7 ~ 1.9
Memory Size256M4G4G512M
Maximum Clock Frequency40018661600800
Data Bus Width16161616
Number of Pins134969684
RoHSCompliantCompliantCompliantCompliant
Lifecycle StatusNot For New DesignsActiveObsoleteActive
Address Bus Width Bit15181815
AutomotiveNoNoNoNo
Dram TypeMobile LPDDR2 SDRAMDDR3L SDRAMDDR3L SDRAMDDR2 SDRAM
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