Winbond Electronics W66CP2NQUAFJ DRAM
IC DRAM 4GBIT LVSTL 11 200WFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66CP2NQUAFJ
Detailed Description
IC DRAM 4GBIT LVSTL 11 200WFBGA
Package
BGA
Lifecycle Status
Last Time Buy
RoHS State
RoHS Compliant
Datasheet
W66CP2NQUAFJ Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W66CP2NQUAFJ DRAM technical specifications.
General
Interface
LVSTL
Memory Size
4G
Data Bus Width
32
Maximum Clock Frequency
3200
RoHS
Compliant
Number of Pins
200
Package / Case
200-WFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TC)
Supply Voltage
1.06V ~ 1.17V, 1.7V ~ 1.95V
Alternate Parts Comparison (W66CP2NQUAFJ vs W634GU6RB-11 vs W9751G6NB-25 vs W9751G6NB25I)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TC) | 0 ~ 95 | 0 ~ 85 | -40 ~ 95 |
| Supply Voltage | 1.06V ~ 1.17V, 1.7V ~ 1.95V | 1.283 ~ 1.45 | 1.7 ~ 1.9 | 1.7 ~ 1.9 |
| Memory Size | 4G | 4G | 512M | 512M |
| Number of Pins | 200 | 96 | 84 | 84 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | LTB | Active | Active | Active |
| Address Bus Width Bit | 17 | 18 | 15 | 15 |
| Automotive | No | No | No | No |
| Data Bus Width Bit | -- | -- | -- | -- |
| Dram Type | Mobile LPDDR4 SDRAM | DDR3L SDRAM | DDR2 SDRAM | DDR2 SDRAM |
| Maximum Access Time Ns | 3.5 | 0.195 | 0.4 | 0.4 |
| Action |
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