Winbond Electronics W66CP2NQQAFJ DRAM
DRAM Memory IC 4G LVSTL 3200 MHz

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66CP2NQQAFJ
Detailed Description
4GB LPDDR4, DDP, X32, 1600MHZ, -
Package
BGA
Lifecycle Status
LTB
RoHS State
RoHS Compliant
Datasheet
W66CP2NQQAFJ Datasheet
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Technical Specifications
Winbond Electronics W66CP2NQQAFJ DRAM technical specifications.
General
Interface
LVSTL
Memory Size
4G
Data Bus Width
32
Maximum Clock Frequency
3200
RoHS
Compliant
Number of Pins
200
Mounting Type
Surface Mount
Operating Temperature
-40 ~ 105
Supply Voltage
1.06/1.7 ~ 1.17/1.95
Lifecycle Status
LTB
Alternate Parts Comparison (W66CP2NQQAFJ vs W956A8MBYA5I vs W634GU6RB-11 vs W631GG6MB12I)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40 ~ 105 | -40°C ~ 85°C (TC) | 0 ~ 95 | -40°C ~ 95°C (TC) |
| Supply Voltage | 1.06/1.7 ~ 1.17/1.95 | 2.7V ~ 3.6V | 1.283 ~ 1.45 | 1.425V ~ 1.575V |
| Memory Size | 4G | 64M | 4G | 1G |
| Number of Pins | 200 | 24 | 96 | 96 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | LTB | Active | Active | Obsolete |
| Address Bus Width Bit | 17 | 24 | 18 | 16 |
| Automotive | No | No | No | No |
| Data Bus Width Bit | -- | -- | -- | -- |
| Dram Type | Mobile LPDDR4 SDRAM | DDR SDRAM | DDR3L SDRAM | DDR3 SDRAM |
| Maximum Access Time Ns | 3.5 | 35(Min) | 0.195 | 0.225 |
| Action |
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