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Winbond Electronics W66CP2NQQAFJ DRAM

DRAM Memory IC 4G LVSTL 3200 MHz

In StockWinbond ElectronicsBGARoHS
W66CP2NQQAFJ - No Image Available

Same model may have multiple batches, images only for reference.

W66CP2NQQAFJ
Part Number (MPN)
W66CP2NQQAFJ
Detailed Description
4GB LPDDR4, DDP, X32, 1600MHZ, -
Package
BGA
Lifecycle Status
LTB
RoHS State
RoHS Compliant
Datasheet
PDF W66CP2NQQAFJ Datasheet
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Technical Specifications

Winbond Electronics W66CP2NQQAFJ DRAM technical specifications.

General

Interface
LVSTL
Memory Size
4G
Data Bus Width
32
Maximum Clock Frequency
3200
RoHS
Compliant
Number of Pins
200
Mounting Type
Surface Mount
Operating Temperature
-40 ~ 105
Supply Voltage
1.06/1.7 ~ 1.17/1.95
Lifecycle Status
LTB

Alternate Parts Comparison (W66CP2NQQAFJ vs W956A8MBYA5I vs W634GU6RB-11 vs W631GG6MB12I)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40 ~ 105-40°C ~ 85°C (TC)0 ~ 95-40°C ~ 95°C (TC)
Supply Voltage1.06/1.7 ~ 1.17/1.952.7V ~ 3.6V1.283 ~ 1.451.425V ~ 1.575V
Memory Size4G64M4G1G
Number of Pins200249696
RoHSCompliantCompliantCompliantCompliant
Lifecycle StatusLTBActiveActiveObsolete
Address Bus Width Bit17241816
AutomotiveNoNoNoNo
Data Bus Width Bit--------
Dram TypeMobile LPDDR4 SDRAMDDR SDRAMDDR3L SDRAMDDR3 SDRAM
Maximum Access Time Ns3.535(Min)0.1950.225
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