Winbond Electronics W66BP6NBUAGJ DRAM

Name: W66BP6NBUAGJ
Brand: Winbond Electronics
SKU: W66BP6NBUAGJ

DRAM Memory IC 2Gb (128M x 16) LVSTL_11 1.866 GHz 1.06V ~ 1.17V, 1.7V ~ 1.95V 200-WFBGA (10x14.5)

In Stock ActiveWinbond ElectronicsBGARoHS

Same model may have multiple batches, images only for reference.

W66BP6NBUAGJ

Manufacturer

Winbond Electronics

Part Number (MPN)

W66BP6NBUAGJ

Technical Specifications

Winbond Electronics W66BP6NBUAGJ DRAM technical specifications.

General

Memory Size

2Gb (128M x 16)

RoHS

Compliant

Number of Pins

200

Package / Case

200-WFBGA

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 105°C (TC)

Supply Voltage

1.06V ~ 1.17V, 1.7V ~ 1.95V

Lifecycle Status

Active

Automotive

Ppap

Alternate Parts Comparison (W66BP6NBUAGJ vs W9751G6NB-25 vs W9751G6NB25I vs W94AD6KBHX5E)

Side-by-side technical parameter comparison of related primary models in this product family.

	This Part	Alternate Parts	Alternate Parts	Alternate Parts
	Winbond ElectronicsW66BP6NBUAGJ	Winbond ElectronicsW9751G6NB-25	Winbond ElectronicsW9751G6NB25I	Winbond ElectronicsW94AD6KBHX5E
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 105°C (TC)	0 ~ 85	-40 ~ 95	-25 ~ 85
Supply Voltage	1.06V ~ 1.17V, 1.7V ~ 1.95V	1.7 ~ 1.9	1.7 ~ 1.9	1.7 ~ 1.9
Memory Size	2Gb (128M x 16)	512M	512M	1G
Number of Pins	200	84	84	60
RoHS	Compliant	Compliant	Compliant	Compliant
Lifecycle Status	Active	Active	Active	Active
Automotive	No	No	No	No
Package	BGA	BGA	BGA	BGA
Package Height	0.47	0.6(Max)	0.6(Max) mm	0.66(Max)
Package Length	14.5	12.5	12.5 mm	9
Package Width	10	8	8 mm	8
Action	RFQ	RFQ	RFQ	RFQ

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