Winbond Electronics W63AH6NBVACI DRAM
DRAM Memory IC 1G HSUL_12 933 MHz 1.14V ~ 1.3V, 1.7V ~ 1.95V 178-VFBGA (11x11.5)

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W63AH6NBVACI
Detailed Description
IC DRAM 1GBIT HSUL 12 178VFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W63AH6NBVACI Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W63AH6NBVACI DRAM technical specifications.
General
Interface
HSUL_12
Memory Size
1G
RoHS
Compliant
Number of Pins
178
Package / Case
178-VFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TC)
Supply Voltage
1.14V ~ 1.3V, 1.7V ~ 1.95V
Lifecycle Status
Active
Automotive
No
Alternate Parts Comparison (W63AH6NBVACI vs W634GU6RB-11 vs W9751G6NB-25 vs W9751G6NB25I)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TC) | 0 ~ 95 | 0 ~ 85 | -40 ~ 95 |
| Supply Voltage | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 1.283 ~ 1.45 | 1.7 ~ 1.9 | 1.7 ~ 1.9 |
| Memory Size | 1G | 4G | 512M | 512M |
| Number of Pins | 178 | 96 | 84 | 84 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Active | Active | Active |
| Automotive | No | No | No | No |
| Dram Type | Mobile LPDDR3 SDRAM | DDR3L SDRAM | DDR2 SDRAM | DDR2 SDRAM |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.67 | 0.6(Max) | 0.6(Max) | 0.6(Max) mm |
| Package Length | 11.5 | 13 | 12.5 | 12.5 mm |
| Action |
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