Winbond Electronics W63AH6NBVABE DRAM

Name: W63AH6NBVABE
Brand: Winbond Electronics
SKU: W63AH6NBVABE

DRAM Memory IC 1G HSUL_12 800 MHz 1.14V ~ 1.3V, 1.7V ~ 1.95V 178-VFBGA (11x11.5)

In Stock ActiveWinbond ElectronicsBGARoHS

Same model may have multiple batches, images only for reference.

W63AH6NBVABE

Manufacturer

Winbond Electronics

Part Number (MPN)

W63AH6NBVABE

Technical Specifications

Winbond Electronics W63AH6NBVABE DRAM technical specifications.

General

Interface

HSUL_12

Memory Size

RoHS

Compliant

Number of Pins

178

Package / Case

178-VFBGA

Mounting Type

Surface Mount

Operating Temperature

-25°C ~ 85°C (TC)

Supply Voltage

1.14V ~ 1.3V, 1.7V ~ 1.95V

Lifecycle Status

Active

Automotive

Alternate Parts Comparison (W63AH6NBVABE vs W634GU6RB-11 vs W9751G6NB-25 vs W9751G6NB25I)

Side-by-side technical parameter comparison of related primary models in this product family.

	This Part	Alternate Parts	Alternate Parts	Alternate Parts
	Winbond ElectronicsW63AH6NBVABE	Winbond ElectronicsW634GU6RB-11	Winbond ElectronicsW9751G6NB-25	Winbond ElectronicsW9751G6NB25I
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Operating Temperature	-25°C ~ 85°C (TC)	0 ~ 95	0 ~ 85	-40 ~ 95
Supply Voltage	1.14V ~ 1.3V, 1.7V ~ 1.95V	1.283 ~ 1.45	1.7 ~ 1.9	1.7 ~ 1.9
Memory Size	1G	4G	512M	512M
Number of Pins	178	96	84	84
RoHS	Compliant	Compliant	Compliant	Compliant
Lifecycle Status	Active	Active	Active	Active
Automotive	No	No	No	No
Dram Type	Mobile LPDDR3 SDRAM	DDR3L SDRAM	DDR2 SDRAM	DDR2 SDRAM
Package	BGA	BGA	BGA	BGA
Package Height	0.67	0.6(Max)	0.6(Max)	0.6(Max) mm
Package Length	11.5	13	12.5	12.5 mm
Action	RFQ	RFQ	RFQ	RFQ

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