Winbond Electronics W35N04JWTBIF Flash Memory
4G-BIT OCTAL NAND FLASH, 1.8V
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W35N04JWTBIF
Detailed Description
4G-BIT OCTAL NAND FLASH, 1.8V
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W35N04JWTBIF Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W35N04JWTBIF Flash Memory technical specifications.
General
RoHS
Compliant
Number of Pins
24
Mounting Type
Surface Mount
Lifecycle Status
Active
Automotive
No
Ppap
No
Package Height
0.85
Package Width
6
Package Length
8
Package
BGA
Alternate Parts Comparison (W35N04JWTBIF vs W29N04GZBIBA vs W29GL128CH9C vs W29GL256SH9C)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Number of Pins | 24 | 63 | 56 | 56 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Active | Obsolete | Obsolete |
| Automotive | No | Yes | No | No |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.85 | 0.6(Max) | 0.85(Max) | 0.85(Max) |
| Package Length | 8 | 11 | 9 | 9 |
| Package Width | 6 | 9 | 7 | 7 |
| Supplier Package | TFBGA | VFBGA | TFBGA | TFBGA |
| Ppap | No | -- | No | No |
| Package / Case | -- | 63-VFBGA | 56-TFBGA | 56-TFBGA |
| Action |
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