Winbond Electronics W25Q32JVTBIQ Flash Memory
Flash Memory IC 32M Serial (SPI, Dual SPI, Quad SPI) 3/3.3V
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q32JVTBIQ
Detailed Description
IC FLASH 32MBIT SPI/QUAD 24TFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W25Q32JVTBIQ Datasheet
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Technical Specifications
Winbond Electronics W25Q32JVTBIQ Flash Memory technical specifications.
General
Interface
Serial (SPI, Dual SPI, Quad SPI)
Memory Size
32M
RoHS
Compliant
Number of Pins
24
Mounting Type
Surface Mount
Operating Temperature
-40 ~ 85
Supply Voltage
3/3.3
Lifecycle Status
Active
Automotive
No
PPAP
No
Related Parts Comparison (W25Q32JVTBIQ vs W35N04JWTBIC vs W71NW20GD3DW vs W29N04GZBIBA)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Number of Pins | 24 | 24 | 130 | 63 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Active | Active | Active |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.85 | 0.85 | 0.68 | 0.6(Max) |
| Package Length | 8 | 8 | 9 | 11 |
| Package Width | 6 | 6 | 8 | 9 |
| Supplier Package | TFBGA | TFBGA | VFBGA | VFBGA |
| Operating Temperature | -40 ~ 85 | -- | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 3/3.3 | -- | 1.7V ~ 1.95V | 1.8 |
| Memory Size | 32M | -- | 2Gb (NAND), 1Gb (LPDDR) | 4G |
| Action |
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