Winbond Electronics W29N08GVBIAF Flash Memory
3.3V NAND Flash Memory
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N08GVBIAF
Detailed Description
3.3V NAND Flash Memory
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
W29N08GVBIAF Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W29N08GVBIAF Flash Memory technical specifications.
General
RoHS
Compliant
Number of Pins
63
Mounting Type
Surface Mount
Lifecycle Status
Obsolete
Automotive
No
Ppap
No
Package Height
0.6(Max)
Package Width
9
Package Length
11
Package
BGA
Alternate Parts Comparison (W29N08GVBIAF vs W29N04GZBIBA vs W29GL128CH9C vs W29GL256SH9C)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Number of Pins | 63 | 63 | 56 | 56 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Obsolete | Active | Obsolete | Obsolete |
| Automotive | No | Yes | No | No |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.6(Max) | 0.6(Max) | 0.85(Max) | 0.85(Max) |
| Package Length | 11 | 11 | 9 | 9 |
| Package Width | 9 | 9 | 7 | 7 |
| Supplier Package | VFBGA | VFBGA | TFBGA | TFBGA |
| Ppap | No | -- | No | No |
| Package / Case | -- | 63-VFBGA | 56-TFBGA | 56-TFBGA |
| Action |
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