Winbond Electronics W29N04GZBIBF Flash Memory
SLC NAND Flash Serial 1.8V 4G-bit 512M x 8 63-Pin VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N04GZBIBF
Detailed Description
SLC NAND Flash Serial 1.8V 4G-bit 512M x 8 63-Pin VFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W29N04GZBIBF Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W29N04GZBIBF Flash Memory technical specifications.
General
Interface
Serial
Memory Size
4G
RoHS
Compliant
Number of Pins
63
Mounting Type
Surface Mount
Operating Temperature
-40 ~ 85
Supply Voltage
1.8
Lifecycle Status
Active
Automotive
No
Ppap
No
Alternate Parts Comparison (W29N04GZBIBF vs W71NW20GD3DW vs W29N04GZBIBA vs W29GL128CH9B)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40 ~ 85 | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8 | 1.7V ~ 1.95V | 1.8 | 3/3.3 |
| Memory Size | 4G | 2Gb (NAND), 1Gb (LPDDR) | 4G | 128M |
| Number of Pins | 63 | 130 | 63 | 64 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Active | Active | Obsolete |
| Automotive | No | No | Yes | No |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.6(Max) | 0.68 | 0.6(Max) | 0.6(Min) |
| Package Length | 11 | 9 | 11 | 13 |
| Package Width | 9 | 8 | 9 | 11 |
| Action |
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