Winbond Electronics W29N02KZBIBE Flash Memory
2G-BIT SERIAL NAND FLASH, 1.8V,
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N02KZBIBE
Detailed Description
2G-BIT SERIAL NAND FLASH, 1.8V,
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W29N02KZBIBE Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W29N02KZBIBE Flash Memory technical specifications.
General
RoHS
Compliant
Number of Pins
63
Mounting Type
Surface Mount
Lifecycle Status
Active
Package Height
1(Max) - 0.25(Min)
Package Width
9
Package Length
11
Package
BGA
Supplier Package
VFBGA
Alternate Parts Comparison (W29N02KZBIBE vs W29GL128CH9C vs W29GL256SH9C vs W29GL128CH9B)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Number of Pins | 63 | 56 | 56 | 64 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Obsolete | Obsolete | Obsolete |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 1(Max) - 0.25(Min) | 0.85(Max) | 0.85(Max) | 0.6(Min) |
| Package Length | 11 | 9 | 9 | 13 |
| Package Width | 9 | 7 | 7 | 11 |
| Supplier Package | VFBGA | TFBGA | TFBGA | LFBGA |
| Package / Case | -- | 56-TFBGA | 56-TFBGA | 64-LBGA |
| Operating Temperature | -- | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | -- | 3/3.3 | 3 | 3/3.3 |
| Action |
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