Winbond Electronics W29N02GZBIAF Flash Memory
Flash Memory IC 2G Parallel 1.8V
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N02GZBIAF
Detailed Description
SLC NAND Flash Parallel 1.8V 2G-bit 256M x 8 63-Pin VFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
Supplier Unconfirmed
Datasheet
W29N02GZBIAF Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W29N02GZBIAF Flash Memory technical specifications.
General
Interface
Parallel
Memory Size
2G
RoHS
Supplier Unconfirmed
Number of Pins
63
Mounting Type
Surface Mount
Operating Temperature
-40 ~ 85
Supply Voltage
1.8
Lifecycle Status
Active
Automotive
No
Ppap
No
Alternate Parts Comparison (W29N02GZBIAF vs W71NW20GD3DW vs W29N04GZBIBA vs W29GL128CH9B)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40 ~ 85 | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8 | 1.7V ~ 1.95V | 1.8 | 3/3.3 |
| Memory Size | 2G | 2Gb (NAND), 1Gb (LPDDR) | 4G | 128M |
| Number of Pins | 63 | 130 | 63 | 64 |
| RoHS | Supplier Unconfirmed | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Active | Active | Obsolete |
| Automotive | No | No | Yes | No |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.6(Max) | 0.68 | 0.6(Max) | 0.6(Min) |
| Package Length | 11 | 9 | 11 | 13 |
| Package Width | 9 | 8 | 9 | 11 |
| Action |
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