Winbond Electronics W29N01HZDINA Flash Memory
Flash Memory IC 1G Parallel 1.8V 48-VFBGA (8x6.5)
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N01HZDINA
Detailed Description
IC FLASH 1GBIT PARALLEL 48VFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W29N01HZDINA Datasheet
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Technical Specifications
Winbond Electronics W29N01HZDINA Flash Memory technical specifications.
General
Interface
Parallel
Memory Size
1G
RoHS
Compliant
Number of Pins
48
Package / Case
48-VFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8
Lifecycle Status
Active
Automotive
No
Related Parts Comparison (W29N01HZDINA vs W71NW20GD3DW vs W25Q32JVTBIQ vs W29N04GZBIBA)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40 ~ 85 | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8 | 1.7V ~ 1.95V | 3/3.3 | 1.8 |
| Memory Size | 1G | 2Gb (NAND), 1Gb (LPDDR) | 32M | 4G |
| Number of Pins | 48 | 130 | 24 | 63 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Active | Active | Active |
| Automotive | No | No | No | Yes |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.6 | 0.68 | 0.85 | 0.6(Max) |
| Package Length | 8 | 9 | 8 | 11 |
| Package Width | 6.5 | 8 | 6 | 9 |
| Action |
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