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Winbond Electronics W25Q64JVZPIM Memory ICs

SPIFLASH, 64M-BIT, DTR, 4KB UNIF

11 ActiveWinbond ElectronicsW25Q8-WDFN Exposed Pad$4.09
W25Q64JVZPIM 8-WDFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

W25Q64JVZPIM
Part Number (MPN)
W25Q64JVZPIM
Base Model
Detailed Description
SPIFLASH, 64M-BIT, DTR, 4KB UNIF
Package
8-WDFN Exposed Pad
Lifecycle Status
Active
Datasheet
PDF W25Q64JVZPIM Datasheet
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Ordering Code Family

W25Q groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

63 ordering variants listed on the family page.

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Technical Specifications

Winbond Electronics W25Q64JVZPIM Memory ICs technical specifications.

General

Series
W25Q64JV
Interface
Serial (SPI, Dual SPI, Quad SPI)
Memory Size
64Mb (8M x 8)
Data Bus Width
8 bit
Maximum Clock Frequency
133 MHz
Active Read Current Max
25 mA
RoHS
Compliant
Number of Pins
8
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount

Alternate Parts Comparison (W25Q64JVZPIM vs W25Q64JVSSIQ-TR vs W25Q64JVSSIQTR vs W25Q16FWSNIQ)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesW25Q64JVW25Q64JVW25Q64JVSpiFlash®
Package / Case8-WDFN Exposed PadSOIC-8SOIC-88-SOIC
Mounting TypeSurface MountSMD/SMTSMD/SMTSurface Mount
Operating Temperature-40°C ~ 85°C (TA)- 40°C ~ + 85°C- 40°C ~ + 85°C-40°C ~ 85°C (TA)
Supply Voltage2.7V ~ 3.6V2.7 V ~ 3.6 V2.7 V ~ 3.6 V1.65V ~ 1.95V
Memory Size64Mb (8M x 8)64 Mbit64 Mbit16 Mbit
InterfaceSerial (SPI, Dual SPI, Quad SPI)SPISPI--
Maximum Clock Frequency133 MHz133 MHz133 MHz--
Data Bus Width8 bit8 bit8 bit--
Active Read Current Max25 mA25 mA25 mA--
Moisture SensitiveYesYesYes--
Timing TypeSynchronousSynchronousSynchronous--
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