Winbond Electronics W25Q
W25Q variants from Winbond Electronics
W25Q Overview
What changes between part numbers, and what to check before you lock the BOM — general-purpose circuits.
Key Features
- Footprint / package: 16-SOIC (0.295", 7.50mm Width), 8-WDFN Exposed Pad, 8-SOIC (0.209", 5.30mm Width), 24-TBGA (+2 more)Land pattern and thermal pad differ between these packages — run a quick footprint check before you swap variants.
- Lifecycle mix: ActiveConfirm lifecycle on the exact MPN, not just the base number prefix.
- 63 distinct suffix patternsExamples: 01JVSFIQ, 01NWZEIQ, 128FVFIG, 128FVFIQ, 128FVSIQ (+58 more). Decode suffix meaning in the ordering notes under the variant table.
Target Applications
- general-purpose circuits — design-in and field replacement
- BOM scrub where only the base prefix is known but suffix is TBD
- Second-source checks when the original MPN is constrained
Ordering Variants
Compare 63 W25Q part numbers by package, electrical parameters, lifecycle, and availability. Use RFQ for stock and lead-time confirmation.
| Part Number | Description | Package Type | Manufacturer | Lifecycle | RoHS | Availability | Action |
|---|---|---|---|---|---|---|---|
| W25Q01JVSFIQ | Package: 16-SOIC (0.295", 7.50mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gb (128M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 16-SOIC (0.295", 7.50mm Width) | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q01NWZEIQ | Package: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 1Gb (128M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128FVFIG | Package: 16-SOIC (0.295", 7.50mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 16-SOIC (0.295", 7.50mm Width) | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128FVFIQ | Package: 16-SOIC (0.295", 7.50mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 16-SOIC (0.295", 7.50mm Width) | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128FVSIQ | Package: 8-SOIC (0.209", 5.30mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-SOIC (0.209", 5.30mm Width) | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128FWFIG | Package: 16-SOIC (0.295", 7.50mm Width) | Mounting Type: Surface Mount | Supply Voltage: 1.65V ~ 1.95V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 16-SOIC (0.295", 7.50mm Width) | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JVBIQ | Package: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 24-TBGA | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JVEIM | Package: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JVEIQ | Package: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JVFIM | Package: 16-SOIC (0.295", 7.50mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 16-SOIC (0.295", 7.50mm Width) | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JVPIM | Package: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JVPIQ | Package: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JVSIQ | Package: 8-SOIC (0.209", 5.30mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-SOIC (0.209", 5.30mm Width) | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JWEIM | Package: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JWEIQ | Package: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JWFIQ | Package: 16-SOIC (0.295", 7.50mm Width) | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 16-SOIC (0.295", 7.50mm Width) | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JWPIM | Package: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q128JWPIQ | Package: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 128Mb (16M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q16CVSSIG | Package: 8-SOIC (0.209", 5.30mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 16Mb (2M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-SOIC (0.209", 5.30mm Width) | Winbond Electronics | Active | Compliant | In Stock | |
| W25Q16DVZPIG | Package: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 16Mb (2M x 8) | Operating Temperature: -40°C ~ 85°C (TA) | 8-WDFN Exposed Pad | Winbond Electronics | Active | Compliant | In Stock |
Ordering Code Differences
How suffixes on W25Q map to package, grade, and reel options.
How to Choose the Right W25Q Variant
Match the footprint first
Packages here: 16-SOIC (0.295", 7.50mm Width), 8-WDFN Exposed Pad, 8-SOIC (0.209", 5.30mm Width), 24-TBGA (+2 more). Open the land-pattern drawing before you substitute a different suffix.
Electrical headroom
Compare voltage and current columns in the variant table. For W25Q, a suffix with lower voltage or current rating will not survive the same circuit without recalculation.
Temp grade letter matters
Commercial (0–70 °C) and industrial (−40–85 °C+) suffixes look similar in the prefix — confirm ambient + self-heating, not just the first page of the datasheet.
Copy the full MPN
Do not BOM only "W25Q" — include the full suffix (e.g. 01JVSFIQ, 01NWZEIQ, 128FVFIG). RFQ with reel/tube preference and required date code.
Technical Specifications
Core parameters for W25Q product family
Identity
Base Model
W25Q
Manufacturer
Winbond Electronics
Listed Variants
63
Variant Parameters
Package Type
16-SOIC (0.295", 7.50mm Width), 8-WDFN Exposed Pad, 8-SOIC (0.209", 5.30mm Width), 24-TBGA, 8-SOIC (0.154", 3.90mm Width), 8-UFDFN Exposed Pad
Lifecycle Status
Active
RoHS Status
Compliant
Source W25Q with Octatronics
Request stock confirmation, lead time, date code, and pricing for all 63 ordering variants from Winbond Electronics. Our team supports active, EOL, and hard-to-find component sourcing.
- Original manufacturer parts with traceability options
- BOM upload and multi-line RFQ support
- Package, grade, and compliance verification
Frequently Asked Questions
Common technical questions about the W25Q product family.
W25Q is a base / family code from Winbond Electronics. You order a full MPN such as W25Q01JVSFIQ, W25Q01NWZEIQ, W25Q128FVFIG. The variant table lists 63 orderable lines with different suffixes.
Listed suffix fragments include: 01JVSFIQ, 01NWZEIQ, 128FVFIG, 128FVFIQ, 128FVSIQ, 128FWFIG. Typically they encode package (16-SOIC (0.295", 7.50mm Width), 8-WDFN Exposed Pad, 8-SOIC (0.209", 5.30mm Width), 24-TBGA (+2 more)), temperature grade, and tape/reel option. Always decode on the Winbond Electronics datasheet ordering guide — do not guess from pattern alone.
On this page the varying fields are: Package Type. Filter the table by the parameter you care about before picking an MPN.
Only after footprint and thermal review. Packages listed here (16-SOIC (0.295", 7.50mm Width), 8-WDFN Exposed Pad, 8-SOIC (0.209", 5.30mm Width), 24-TBGA (+2 more)) use different land patterns and often different thermal resistance. Layout swaps need a new paste stencil at minimum, not just a BOM edit.
Lifecycle values in our listing: Active. Status is per MPN suffix — one variant can be Active while another is NRND. Check PCN for your exact suffix before multi-year commitments.
Full manufacturer MPN (not just W25Q), quantity, needed date code, reel vs tube, and any compliance docs (CoC, RoHS, conflict minerals). If you only know the base prefix, include a photo of the existing label or reel.
Use the datasheet link in the page header. Cross-check electrical curves (SOA, saturation voltage, etc.) against your operating point — the table summarizes order codes, not every graph in the PDF.