Winbond Electronics W25Q512NWBIM Flash Memory
Flash Memory IC 512M SPI - Quad I/O, QPI, DTR 133 MHz 1.8V 24-TFBGA (8x6)
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q512NWBIM
Detailed Description
IC FLASH 512MBIT SPI 24TFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
W25Q512NWBIM Datasheet
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Technical Specifications
Winbond Electronics W25Q512NWBIM Flash Memory technical specifications.
General
Interface
Serial (SPI, Dual SPI, Quad SPI)
Memory Size
512M
RoHS
Compliant
Number of Pins
24
Package / Case
24-TBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8
Lifecycle Status
Active
Cell Type
NOR
Related Parts Comparison (W25Q512NWBIM vs W71NW20GD3DW vs W25Q32JVTBIQ vs W29N04GZBIBA)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40 ~ 85 | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.8 | 1.7V ~ 1.95V | 3/3.3 | 1.8 |
| Memory Size | 512M | 2Gb (NAND), 1Gb (LPDDR) | 32M | 4G |
| Number of Pins | 24 | 130 | 24 | 63 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Active | Active | Active |
| Package | BGA | BGA | BGA | BGA |
| Package Height | 0.85 | 0.68 | 0.85 | 0.6(Max) |
| Package Length | 8 | 9 | 8 | 11 |
| Package Width | 6 | 8 | 6 | 9 |
| Supplier Package | TFBGA | VFBGA | TFBGA | VFBGA |
| Action |
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