Winbond Electronics W25Q128JVBIQ Memory ICs
IC FLSH 128MBIT SPI/QUAD 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q128JVBIQ
Base Model
Detailed Description
IC FLSH 128MBIT SPI/QUAD 24TFBGA
Package
24-TBGA
Lifecycle Status
Active
Datasheet
W25Q128JVBIQ Datasheet
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Technical Specifications
Winbond Electronics W25Q128JVBIQ Memory ICs technical specifications.
General
Series
SpiFlash®
Interface
SPI
Memory Size
128Mb (16M x 8)
Data Bus Width
8 bit
Maximum Clock Frequency
133 MHz
Active Read Current Max
25 mA
RoHS
ROHS3 Compliant
Package / Case
24-TBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Alternate Parts Comparison (W25Q128JVBIQ vs W25Q64JVSSIQ vs W25Q80DVSSIG vs W25Q64JVSSIQ-TR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | SMD/SMT |
| Operating Temperature | -40°C ~ 85°C (TA) | -40 ~ 85 | -40 ~ 85 | - 40°C ~ + 85°C |
| Supply Voltage | 2.7V ~ 3.6V | 3/3.3 | 3/3.3 | 2.7 V ~ 3.6 V |
| Memory Size | 128Mb (16M x 8) | 64M | 8M | 64 Mbit |
| Interface | SPI | Serial (SPI, Dual SPI, Quad SPI) | Serial (SPI, Dual SPI, Quad SPI) | SPI |
| Timing Type | Synchronous | Synchronous | Synchronous | Synchronous |
| RoHS | ROHS3 Compliant | Compliant | Compliant | -- |
| Lifecycle Status | Active | Active | LTB | -- |
| Max Frequency | 133 MHz | 133 | 104 | -- |
| Package | 24-TBGA | SO | SO | -- |
| Action |
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