Winbond Electronics W25N01GVSFIG Memory ICs
1G-BIT SERIAL NAND FLASH, 3V
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25N01GVSFIG
Series
Base Model
Detailed Description
Package
16-SOIC (0.295", 7.50mm Width)
Key Features
Package: 16-SOIC (0.295", 7.50mm Width); Supply Voltage: 2.7V ~ 3.6V; Memory Size: 1Gb (128M x 8)
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W25N01GVSFIG Datasheet
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Technical Specifications
Winbond Electronics W25N01GVSFIG Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package
16-SOIC (0.295", 7.50mm Width)
Technology
FLASH - NAND (SLC)
Supplier Device Package
16-SOIC
Memory Size
1Gb (128M x 8)
Memory Type
Non-Volatile
Supply Voltage
2.7V ~ 3.6V
Max Frequency
104 MHz
Access Time
7 ns
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W25N02KVZEIRWinbond ElectronicsPackage: SON | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 2G | Interface: Serial (SPI, Dual SPI, Quad SPI) | Number of Pins: 8
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W25N01GVZEITWinbond ElectronicsPackage: Tray | Package / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gbit | Interface: SPI | Operating Temperature: -40°C ~ 85°C (TA) | Organization: 128 M x 8