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Winbond Electronics W25N01GVZEIG Memory ICs

WSON-8-EP(6.1x8) NAND FLASH

10,701 ActiveWinbond Electronics8-WDFN Exposed Pad$3.30RoHS
W25N01GVZEIG 8-WDFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

W25N01GVZEIG
Part Number (MPN)
W25N01GVZEIG
Detailed Description
High-performance Winbond Electronics Memory ICs for stable electronic control.
Package
8-WDFN Exposed Pad
Lifecycle Status
Active
RoHS State
RoHS Compliant
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Technical Specifications

Winbond Electronics W25N01GVZEIG Memory ICs technical specifications.

General

Series
SpiFlash®
Interface
Serial (SPI, Dual SPI, Quad SPI)
Memory Size
1Gbit
Data Bus Width
8 bit
Maximum Clock Frequency
104 MHz
Active Read Current Max
35 mA
RoHS
Compliant
Number of Pins
8
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount

Related Parts Comparison (W25N01GVZEIG vs W25Q128JVSIQTR vs W25Q128JVFIQ TR vs W25Q128JWPIM TR)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
SeriesSpiFlash®W25Q128JVSpiFlash®SpiFlash®
Package / Case8-WDFN Exposed PadSOIC-816-SOIC8-WDFN Exposed Pad
Mounting TypeSurface MountSMD/SMTSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)- 40°C ~ + 85°C-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.7V ~ 3.6V2.7 V ~ 3.6 V2.7V ~ 3.6V1.7V ~ 1.95V
Memory Size1Gbit128 Mbit128 Mbit128 Mbit
Memory Organization128M x 816 M x 816M x 816M x 8
Lifecycle StatusLTB--ActiveActive
Clock Frequency104 MHz--133 MHz133 MHz
Max Frequency104 MHz--133 MHz133 MHz
Memory FormatFlash--FlashFlash
Memory InterfaceSPI - Quad I/O--SPI - Quad I/O, QPI, DTRSPI - Quad I/O
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