Winbond Electronics W25N01GVZEIG Memory ICs
WSON-8-EP(6.1x8) NAND FLASH
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25N01GVZEIG
Series
Detailed Description
Package
8-WDFN Exposed Pad
Key Features
Package / Case: 8-WDFN Exposed Pad; Supplier Device Package: 8-WSON (8x6); Voltage - Supply: 2.7V ~ 3.6V; Interface: SPI - Quad I/O; Memory Size: 1Gbit; Technology: FLASH - NAND (SLC)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25N01GVZEIG Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
8-WDFN Exposed Pad
Technology
FLASH - NAND (SLC)
Supplier Device Package
8-WSON (8x6)
Memory Size
1Gbit
Memory Type
Non-Volatile
Supply Voltage
2.7V ~ 3.6V
Max Frequency
104 MHz
Access Time
7 ns
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W25Q128JVSIQTRWinbond ElectronicsPackage: Reel | Package / Case: SOIC-8 | Memory Size: 128 Mbit | Interface: SPI | Organization: 16 M x 8
W25Q128FVPIQWinbond ElectronicsPackage: Tube | Package / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mbit | Operating Temperature: -40°C ~ 85°C (TA)