Texas Instruments TPS6521835RSLR Special Purpose
IC POWER
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
TPS6521835RSLR
Detailed Description
IC POWER
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
TPS6521835RSLR Datasheet
Quick Jump:
Technical Specifications
Texas Instruments TPS6521835RSLR Special Purpose technical specifications.
General
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Lifecycle Status
Active
Input Voltage
2.2V ~ 5.5V
Output Voltage
Multiple
Number of Outputs
7
Applications
Converter, DDR, DDR2, DDR3
Related Parts Comparison (TPS6521835RSLR vs TPS65185RGZR vs TPS65216D0RSLR vs TPS65182RGZR)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -10°C ~ 85°C | -40°C ~ 105°C | -10°C ~ 85°C |
| Lifecycle Status | Active | Active | Active | Not For New Designs |
| Applications | Converter, DDR, DDR2, DDR3 | E Ink®, Vizplex™ Display, OMAP™ | Industrial Automation | E Ink®, Vizplex™ Display, OMAP™ |
| Supply Voltage | -- | 3V ~ 6V | 3.6V ~ 5.5V | 3V ~ 6V |
| Current Supply | -- | 5.5mA | 220µA | 5.5mA |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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