NXP Semiconductors MC32PF3000A7EP Microcontrollers
POWER MANAGEMENT IC I.MX7 PRE-
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC32PF3000A7EP
Base Model
Detailed Description
POWER MANAGEMENT IC I.MX7 PRE-
Package
48-VFQFN Exposed Pad
Lifecycle Status
Active
Datasheet
MC32PF3000A7EP Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MC32PF3000A7EP Microcontrollers technical specifications.
General
RoHS
Yes
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
2.8V ~ 5.5V
Lifecycle Status
Active
Applications
i.MX Processors
Issimilarsample
Yes
Pack Type
REEL
Price Flg
Y
Related Parts Comparison (MC32PF3000A7EP vs MC32PF4210A0ES vs MC32PF3000A1EPR2 vs MC32PF1550A1EPR2)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 48-VFQFN Exposed Pad | 56-VFQFN Exposed Pad | 48-VFQFN Exposed Pad | 40-VFQFN Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount, Wettable Flank | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | 0°C ~ 85°C (TA) | -40°C ~ 85°C | -40°C ~ 85°C |
| Supply Voltage | 2.8V ~ 5.5V | 2.8V ~ 4.5V | 2.8V ~ 5.5V | 3.8V ~ 7V |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active |
| Applications | i.MX Processors | Audio, Video | i.MX Processors | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
| Package | 48-VFQFNExposedPad | 56-VFQFN | SOT619-18 | SOT1369-4 |
| Issimilarsample | Yes | -- | Yes | Yes |
| Pack Desc | Reel 13" Q2/T3 in Drypack | -- | Reel 13" Q2/T3 in Drypack | Reel 13" Q2/T3 in Drypack |
| Pack Type | REEL | -- | REEL | REEL |
| Price Flg | Y | -- | Y | Y |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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INTEGRATED POWER MANAGEMENT IC (
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