Texas Instruments AM3352BZCZD80 Microprocessors
MPU AM335x RISC 32bit 800MHz 1.8V/3.3V Automotive 324-Pin NFBGA Tray
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
AM3352BZCZD80
Detailed Description
Advanced Texas AM3352BZCZD80 Microprocessors for precision electronics.
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
AM3352BZCZD80 Datasheet
Quick Jump:
Technical Specifications
Texas Instruments AM3352BZCZD80 Microprocessors technical specifications.
General
Interface
CAN, Ethernet, I2C, SPI, UART, USB
RAM Size
64 kB
Data Bus Width
32 b
RoHS
Compliant
Number of Pins
324
Package / Case
324-LFBGA
Operating Temperature
-40°C ~ 90°C (TJ)
Supply Voltage
1.26 V
Lifecycle Status
Production
Manufacturer Lifecycle Status
Active
Related Parts Comparison (AM3352BZCZD80 vs AM26S10CD vs AM26S10CDG4 vs AM26LS33ACN)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 324-LFBGA | 16-SOIC | 16-SOIC | 16-DIP |
| Operating Temperature | -40°C ~ 90°C (TJ) | 0°C ~ 70°C | 0°C ~ 70°C | 0°C ~ 70°C |
| Supply Voltage | 1.26 V | 5V | 5V | 5V |
| RoHS | Compliant | Yes | Yes | Yes |
| Lifecycle Status | Production | Active | Obsolete | Active |
| Contact Plating | Copper, Silver, Tin | Gold | Gold | Gold |
| Lead Free | Lead Free | Lead Free | Lead Free | Lead Free |
| Package | BGA | SOIC | SOIC | N |
| Weight | 1.713814 g | 0.004998oz | 0.004998oz | 0.03357oz |
| Height | 1.4 mm | -- | 1.58mm | 4.57mm |
| Length | 15 mm | -- | 9.9mm | 19.3mm |
| Operating Temperature Range C | -40 to 105, -40 to 125, -40 to 90, 0 to 90 | 0 to 70 | -- | 0 to 70 |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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