Samsung Semiconductor K4T51163QI-HCE6 DRAM
DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84,
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4T51163QI-HCE6
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 512M; Interface: SSTL_1.8
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4T51163QI-HCE6 DRAM technical specifications.
General
RoHS
Compliant
Inventory Source
Winsource
Inventory Source File
/Volumes/T7 Shield/电子元器件数据/抓取的数据/Win-Source数据/winsource_未曾下架数据_202605_1.xlsx
Inventory As of
2026-05-15
Source Manufacturer
Samsung
Source Category
Integrated Circuits (ICs) > Memory > Unclassified Memory
Stock
1900
Extracted Price
1.4576
Price Formula
winsource min price * 2
ECCN
EAR99
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
K4B2G1646F-BYK0Samsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 2G | Number of Pins: 96 | Organization: 128Mx16
K4B4G1646D-BYK0Samsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
K4B4G1646D-BHMASamsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
K4E6E304EC-EGCGSamsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 16G | Number of Pins: 178 | Organization: 512Mx32