Samsung Semiconductor K4A4G165WE-BIWE DRAM
4Gb E-die DDR4 SDRAM

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4A4G165WE-BIWE
Detailed Description
4Gb E-die DDR4 SDRAM
Package
BGA
Lifecycle Status
Last Time Buy
RoHS State
RoHS Compliant
Datasheet
K4A4G165WE-BIWE Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4A4G165WE-BIWE DRAM technical specifications.
General
Interface
POD
Memory Size
4G
RoHS
Compliant
Number of Pins
96
Mounting Type
Surface Mount
Supply Voltage
1.2
Lifecycle Status
LTB
Number of Bits Word Bit
16
Number of IO Lines Bit
16
Organization
256Mx16
Alternate Parts Comparison (K4A4G165WE-BIWE vs K4B4G1646D-BHMA vs K4E6E304EC-EGCG vs K4A8G165WC-BCRC)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Memory Size | 4G | 4G | 16G | 8G |
| Number of Pins | 96 | 96 | 178 | 96 |
| RoHS | Compliant | Supplier Unconfirmed | Compliant | Supplier Unconfirmed |
| Lifecycle Status | LTB | Obsolete | Obsolete | Active |
| Automotive | No | No | No | No |
| Data Bus Width Bit | 16 | 16 | 32 | 16 |
| Dram Type | DDR4 SDRAM | DDR3 SDRAM | Mobile LPDDR3 SDRAM | DRAM |
| Number of IO Lines Bit | 16 | 16 | 32 | 16 |
| Organization | 256Mx16 | 256Mx16 | 512Mx32 | 512Mx16 |
| Package | BGA | BGA | BGA | BGA |
| Ppap | No | No | No | No |
| Action |
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