Skip to main content

Samsung Semiconductor K4A4G165WE-BIWE DRAM

4Gb E-die DDR4 SDRAM

396Samsung SemiconductorBGA$18.89RoHS
K4A4G165WE-BIWE - No Image Available

Same model may have multiple batches, images only for reference.

K4A4G165WE-BIWE
Part Number (MPN)
K4A4G165WE-BIWE
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Supply Voltage: 1.2; Memory Size: 4G; Interface: POD
Lifecycle Status
LTB
RoHS State
Compliant
Datasheet
PDF K4A4G165WE-BIWE Datasheet
Quick Jump:
Ready to order?In stock and ready to ship.
Competitive Pricing
Fast & Reliable Delivery
Quality Assured

Technical Specifications

Samsung Semiconductor K4A4G165WE-BIWE DRAM technical specifications.

General

Number of Bits Word Bit
16
Number of IO Lines Bit
16
Organization
256Mx16
HTS
EA
ECCN
EAR99
Ppap
No
Package Length
13.3
Data Bus Width Bit
16
Package
BGA
Automotive
No

More in This Category

Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
K4B2G1646F-BYK0K4B2G1646F-BYK0Samsung Semiconductor
Package: BGA | Mounting Type: Surface Mount | Memory Size: 2G | Number of Pins: 96 | Organization: 128Mx16
K4B4G1646D-BYK0K4B4G1646D-BYK0Samsung Semiconductor
Package: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
K4B4G1646D-BHMAK4B4G1646D-BHMASamsung Semiconductor
Package: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
K4E6E304EC-EGCGK4E6E304EC-EGCGSamsung Semiconductor
Package: BGA | Mounting Type: Surface Mount | Memory Size: 16G | Number of Pins: 178 | Organization: 512Mx32