Samsung Semiconductor K4E6E304EB-EGCF DRAM
DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4E6E304EB-EGCF
Detailed Description
DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA
Package
BGA
Lifecycle Status
Active
RoHS State
Supplier Unconfirmed
Datasheet
K4E6E304EB-EGCF Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4E6E304EB-EGCF DRAM technical specifications.
General
Memory Size
16G
RoHS
Supplier Unconfirmed
Number of Pins
178
Mounting Type
Surface Mount
Operating Temperature
-25 ~ 70
Lifecycle Status
Active
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR3 SDRAM
Organization
512Mx32
Alternate Parts Comparison (K4E6E304EB-EGCF vs K4B4G1646D-BHMA vs K4E6E304EC-EGCG vs K4A8G165WC-BCRC)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -25 ~ 70 | -40 ~ 105 | -25 ~ 85 | 0 ~ 85 |
| Memory Size | 16G | 4G | 16G | 8G |
| Number of Pins | 178 | 96 | 178 | 96 |
| RoHS | Supplier Unconfirmed | Supplier Unconfirmed | Compliant | Supplier Unconfirmed |
| Lifecycle Status | Active | Obsolete | Obsolete | Active |
| Automotive | No | No | No | No |
| Data Bus Width Bit | 32 | 16 | 32 | 16 |
| Dram Type | Mobile LPDDR3 SDRAM | DDR3 SDRAM | Mobile LPDDR3 SDRAM | DRAM |
| Maximum Clock Rate Mhz | 1866 | 1866 | 2133 | 2400 |
| Number of IO Lines Bit | 32 | 16 | 32 | 16 |
| Organization | 512Mx32 | 256Mx16 | 512Mx32 | 512Mx16 |
| Action |
More Parts in DRAM
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.
K4B2G1646F-BYK0Samsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 2G | Number of Pins: 96 | Organization: 128Mx16
K4B4G1646D-BYK0Samsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
K4B4G1646D-BHMASamsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
K4E6E304EC-EGCGSamsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 16G | Number of Pins: 178 | Organization: 512Mx32