Samsung Semiconductor K4E6E304EC-EGCG DRAM
DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4E6E304EC-EGCG
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 16G
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
K4E6E304EC-EGCG Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4E6E304EC-EGCG DRAM technical specifications.
General
RoHS
Compliant
ECCN
EAR99
Lifecycle Status
Obsolete
HTS
8542.32.00.36
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR3 SDRAM
Memory Size
16G
Organization
512Mx32
Number of Bits Word Bit
32
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
K4B2G1646F-BYK0Samsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 2G | Number of Pins: 96 | Organization: 128Mx16
K4B4G1646D-BYK0Samsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
K4B4G1646D-BHMASamsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 4G | Number of Pins: 96 | Organization: 256Mx16
K4B2G1646F-BCNBSamsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 2G | Interface: SSTL_1.5 | Number of Pins: 96 | Organization: 128Mx16