Samsung Semiconductor K4A4G085WE-BCPB DRAM
DRAM Chip DDR4 SDRAM 4Gbit 512Mx8 1.2V 78-Pin FBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4A4G085WE-BCPB
Detailed Description
Package
FBGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 4G; Interface: POD
Lifecycle Status
LTB
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4A4G085WE-BCPB DRAM technical specifications.
General
Organization
512Mx8
HTS
8542.32.00.36
ECCN
EAR99
Ppap
No
Data Bus Width Bit
8
Operating Current Ma
84
Number of Internal Banks
16
Automotive
No
Address Bus Width Bit
17
Min Operating Temp
0
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
K4H560838H-UCCCSamsung SemiconductorPackage / Case: FBGA | Supply Voltage: 2.6V | Access Time Max: 0.55ns | Address Bus Width: 15b | Data Bus Width: 8b | Density: 256Mb
K4T1G084QF-BCE6Samsung SemiconductorPackage / Case: FBGA | Supply Voltage: 1.8V | Access Time: 0.45ns | Address Bus Width: 17b | Density: 1Gb | Max Frequency: 667MHz
K4AAG165WA-BCTDSamsung SemiconductorPackage: BGA | Mounting Type: Surface Mount | Memory Size: 16G | Interface: POD | Number of Pins: 96 | Organization: 1Gx16
K4T1G164QF-BCE6Samsung SemiconductorPackage / Case: FBGA | Supply Voltage: 1.8V | Access Time: 0.45ns | Access Time Max: 0.45ns | Density: 1Gb | Max Frequency: 667MHz