Renesas UPD70F3507GJ(A2)-GBG-SSA-AX Microcontroller, Microprocessor, FPGA Modules
IC MCU 32B 512KB FLASH 144HLFQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
UPD70F3507GJ(A2)-GBG-SSA-AX
Detailed Description
IC MCU 32B 512KB FLASH 144HLFQFP
Package
144-LQFP Exposed Pad
Key Features
Package / Case: 144-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
UPD70F3507GJ(A2)-GBG-SSA-AX Datasheet
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Technical Specifications
Renesas UPD70F3507GJ(A2)-GBG-SSA-AX Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
40K x 8
Package / Case
144-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
4.5V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
DMA, PWM, WDT
Number of I/O
73
Speed
160MHz
EEPROM Size
32K x 8
Related Parts Comparison (UPD70F3507GJ(A2)-GBG-SSA-AX vs UPD48576218F1-E24-DW1-E2-A vs UPD48576236F1-E24-DW1-E2-A vs UPD48576218F1-E24-DW1-A)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | 144-TBGA | 144-TBGA | 144-TBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) | 0°C ~ 95°C (TC) | 0°C ~ 95°C (TC) | 0°C ~ 95°C (TC) |
| Supply Voltage | 4.5V ~ 5.5V | 1.7V ~ 1.9V | 1.7V ~ 1.9V | 1.7V ~ 1.9V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Memory Size | -- | 576Mb (32M x 18) | 576Mb (16M x 36) | 576Mb (32M x 18) |
| Access Time | -- | 20 ns | 20 ns | 20 ns |
| Clock Frequency | -- | 400 MHz | 400 MHz | 400 MHz |
| Max Frequency | -- | 400 MHz | 400 MHz | 400 MHz |
| Memory Format | -- | DRAM | DRAM | DRAM |
| Memory Interface | -- | HSTL | HSTL | HSTL |
| Memory Organization | -- | 32M x 18 | 16M x 36 | 32M x 18 |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
Suggested replacements
MCF52254AF80NXP SemiconductorsNXP
IC MCU 32BIT 512KB FLASH 100LQFP
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