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Renesas UPD48576236F1-E24-DW1-E2-A Memory Integrated Circuit

IC DRAM 576MBIT HSTL 144TFBGA

7,673Renesas144-TBGARoHS
UPD48576236F1-E24-DW1-E2-A - No Image Available

Same model may have multiple batches, images only for reference.

UPD48576236F1-E24-DW1-E2-A
Manufacturer
Part Number (MPN)
UPD48576236F1-E24-DW1-E2-A
Detailed Description
IC DRAM 576MBIT HSTL 144TFBGA
Package
144-TBGA
Key Features
Package / Case: 144-TBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF UPD48576236F1-E24-DW1-E2-A Datasheet
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Technical Specifications

Renesas UPD48576236F1-E24-DW1-E2-A Memory Integrated Circuit technical specifications.

General

Memory Size
576Mb (16M x 36)
Package / Case
144-TBGA
Packaging
Tray
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 95°C (TC)
Supply Voltage
1.7V ~ 1.9V
Lifecycle Status
Obsolete
Technology
LLDRAM2
Memory Type
Volatile
Max Frequency
400 MHz

Alternate Parts Comparison (UPD48576236F1-E24-DW1-E2-A vs UPD48576118F1-E24-DW1-A vs UPD48576118F1-E24Y-DW1-A vs UPD48576118F1-E24-DW1-E2-A)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case144-TBGA144-TBGA144-TBGA144-TBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 95°C (TC)0°C ~ 95°C (TC)0°C ~ 95°C (TC)0°C ~ 95°C (TC)
Supply Voltage1.7V ~ 1.9V1.7V ~ 1.9V1.7V ~ 1.9V1.7V ~ 1.9V
Memory Size576Mb (16M x 36)576Mb (32M x 18)576Mb (32M x 18)576Mb (32M x 18)
Access Time20 ns20 ns20 ns20 ns
Max Frequency400 MHz400 MHz400 MHz400 MHz
Memory FormatDRAMDRAMDRAMDRAM
Memory InterfaceHSTLHSTLHSTLHSTL
Memory TypeVolatileVolatileVolatileVolatile
TechnologyLLDRAM2LLDRAM2LLDRAM2LLDRAM2
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