Renesas R7F7017113ABG-C#AC1 Microcontroller, Microprocessor, FPGA Modules
32BIT MCU
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7F7017113ABG-C#AC1
Detailed Description
32BIT MCU
Package
233-FBGA
Key Features
Package / Case: 233-FBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
R7F7017113ABG-C#AC1 Datasheet
Quick Jump:
Technical Specifications
Renesas R7F7017113ABG-C#AC1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
RH850/F1x
RAM Size
1.03M x 8
Data Bus Width
32 bit
Maximum Clock Frequency
240 MHz
RoHS
True
Package / Case
233-FBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Active
Alternate Parts Comparison (R7F7017113ABG-C#AC1 vs R7S721031VCBG#AC0 vs R7F7017103ABG-C#BC1 vs R7F7017114ABG-C#HC1)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 233-FBGA | 233-FBGA | 233-FBGA | 233-FBGA |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) |
| Core Processor | RH850G3KH | ARM® Cortex®-A9 | RH850G3KH | RH850G3KH |
| Speed | 240MHz | 400MHz | 240MHz | 240MHz |
| Series | RH850/F1x | -- | RH850/F1KM-D8 | RH850/F1x |
| Supply Voltage | 3V ~ 5.5V | -- | 3V ~ 5.5V | 3V ~ 5.5V |
| Core Size | 32-Bit Dual-Core | -- | 32-Bit Dual-Core | 32-Bit Dual-Core |
| RAM Size | 1.03M x 8 | -- | 896K x 8 | 1M x 8 |
| Connectivity | CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART | -- | CANbus, CSI, I²C, LINbus, SPI, UART/USART | CANbus, CSI, I²C, LINbus, SPI, UART/USART |
| Data Converters | A/D 38x10b, 32x12b | -- | A/D 38x10b, 32x12b | A/D 38x10b, 32x12b |
| EEPROM Size | 256K x 8 | -- | 256K x 8 | 256K x 8 |
| Oscillator Type | Internal | -- | Internal | Internal |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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