Renesas R7F7017103ABG-C#BC1 Microcontroller, Microprocessor, FPGA Modules
32BIT MCU RH850/F1KH 6MB
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7F7017103ABG-C#BC1
Detailed Description
32BIT MCU RH850/F1KH 6MB
Package
233-FBGA
Key Features
Package / Case: 233-FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
R7F7017103ABG-C#BC1 Datasheet
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Technical Specifications
Renesas R7F7017103ABG-C#BC1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
RH850/F1KM-D8
RAM Size
896K x 8
Data Bus Width
32 bit
Maximum Clock Frequency
240 MHz
RoHS
Yes
Package / Case
233-FBGA
Mounting Type
SMD/SMT
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Active
Alternate Parts Comparison (R7F7017103ABG-C#BC1 vs R7S721031VCBG#AC0 vs R5F10Y47ASP#30 vs R5F51306ADFN#10)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 233-FBGA | 233-FBGA | 16-SSOP | 80-LQFP |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Core Processor | RH850G3KH | ARM® Cortex®-A9 | RL78 | RX |
| Speed | 240MHz | 400MHz | 20MHz | 32MHz |
| Supply Voltage | 3V ~ 5.5V | -- | 2V ~ 5.5V | 1.8V ~ 5.5V |
| Core Size | 32-Bit Dual-Core | -- | 16-Bit | 32-Bit Single-Core |
| RAM Size | 896K x 8 | -- | 512 x 8 | 32K x 8 |
| Connectivity | CANbus, CSI, I²C, LINbus, SPI, UART/USART | -- | CSI, I²C, LINbus, UART/USART | I²C, LINbus, SCI, SPI |
| Data Converters | A/D 38x10b, 32x12b | -- | A/D 7x8/10b | A/D 17x12b; D/A 2x8b |
| Oscillator Type | Internal | -- | Internal | Internal |
| Peripherals | DMA, PWM, WDT | -- | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT |
| Program Memory Size | 6MB (6M x 8) | -- | 4KB (4K x 8) | 256KB (256K x 8) |
| Action |
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