Renesas DF36054HV Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 32KB FLASH 64QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DF36054HV
Detailed Description
IC MCU 16BIT 32KB FLASH 64QFP
Package
64-BQFP
Key Features
Package / Case: 64-BQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
DF36054HV Datasheet
Quick Jump:
Technical Specifications
Renesas DF36054HV Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
2K x 8
RoHS
Yes
Package / Case
64-BQFP
Mounting Type
Surface Mount
Operating Temperature
-20°C ~ 75°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
PWM, WDT
Number of I/O
45
Speed
20MHz
Related Parts Comparison (DF36054HV vs DF36077GHV vs DF71250AD50FAV vs DF71250AN50FAV)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 64-BQFP | 64-BQFP | 64-BQFP | 64-BQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) | -40°C ~ 85°C (TA) | -20°C ~ 85°C (TA) |
| Supply Voltage | 3V ~ 5.5V | 4.5V ~ 5.5V | 4V ~ 5.5V | 4V ~ 5.5V |
| Core Processor | H8/300H | H8/300H | SH-2 | SH-2 |
| Core Size | 16-Bit | 16-Bit | 32-Bit Single-Core | 32-Bit Single-Core |
| RAM Size | 2K x 8 | 4K x 8 | 4K x 8 | 4K x 8 |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete | Obsolete | Active | Active |
| Connectivity | CANbus, SCI, SSU | I²C, SCI | SCI | SCI |
| Data Converters | A/D 8x10b | A/D 8x10b | A/D 8x10b | A/D 8x10b |
| Number of I/O | 45 | 47 | 37 | 37 |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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