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Renesas HD64F3687GHV Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 56KB FLASH 64QFP

2,886Renesas64-BQFPRoHS
HD64F3687GHV 64-BQFP package illustration

Same model may have multiple batches, images only for reference.

HD64F3687GHV
Manufacturer
Part Number (MPN)
HD64F3687GHV
Detailed Description
IC MCU 16BIT 56KB FLASH 64QFP
Package
64-BQFP
Key Features
Package / Case: 64-BQFP; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
RoHS Compliant
Datasheet
PDF HD64F3687GHV Datasheet
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Technical Specifications

Renesas HD64F3687GHV Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
H8/3687
RAM Size
4K x 8
Data Bus Width
16 bit
Maximum Clock Frequency
20 MHz
RoHS
Yes
Package / Case
64-BQFP
Mounting Type
Surface Mount
Operating Temperature
-20°C ~ 75°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Not For New Designs

Related Parts Comparison (HD64F3687GHV vs HD64F3684HV vs HD64F3694GHV vs HD64F3687HV)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case64-BQFP64-BQFP64-BQFP64-BQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)
Supply Voltage3V ~ 5.5V3V ~ 5.5V3V ~ 5.5V3V ~ 5.5V
Core ProcessorH8/300HH8/300HH8/300HH8/300H
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size4K x 84K x 82K x 84K x 8
RoHSYesYesYesYes
Lifecycle StatusNot For New DesignsActiveObsoleteActive
ConnectivityI²C, SCII²C, SCII²C, SCII²C, SCI
Data ConvertersA/D 8x10bA/D 8x10bA/D 8x10bA/D 8x10b
Number of I/O45452945
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