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NXP Semiconductors SPC5516EAVMG80 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 1MB FLASH 208MAPBGA

1,850 ActiveNXP Semiconductors208-BGARoHS
SPC5516EAVMG80 - No Image Available

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SPC5516EAVMG80
Manufacturer
Part Number (MPN)
SPC5516EAVMG80
Detailed Description
IC MCU 32BIT 1MB FLASH 208MAPBGA
Package
208-BGA
Key Features
Package / Case: 208-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF SPC5516EAVMG80 Datasheet
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Technical Specifications

NXP Semiconductors SPC5516EAVMG80 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
64K x 8
Package / Case
208-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
4.5V ~ 5.25V
Lifecycle Status
Active
Peripherals
DMA, POR, PWM, WDT
Number of I/O
144
Speed
80MHz
Core Processor
e200z0, e200z1

Alternate Parts Comparison (SPC5516EAVMG80 vs SPC5644AF0MMG2R vs SPC5644AF0MMG3 vs SPC5534MVM80)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case208-BGA208-BGA208-BGA208-BGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C-40°C ~ 125°C (TA)
Supply Voltage4.5V ~ 5.25V1.14V ~ 5.25V1.14V ~ 1.32V1.35V ~ 1.65V
Core Processore200z0, e200z1e200z4e200z4e200z6
Core Size32-Bit Dual-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size64K x 8192K x 8192K x 864K x 8
ConnectivityCANbus, EBI/EMI, I²C, SCI, SPICANbus, EBI/EMI, LINbus, SCI, SPICANbus, EBI/EMI, LINbus, SCI, SPICANbus, EBI/EMI, Ethernet, SCI, SPI
Data ConvertersA/D 40x12bA/D 40x12bA/D 40x12bA/D 34x12b
Number of I/O144120120192
Oscillator TypeInternalInternalInternalExternal
PeripheralsDMA, POR, PWM, WDTDMA, POR, PWM, WDTDMA, POR, PWM, WDTDMA, POR, PWM, WDT
Action

Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

This part is listed as a cross for

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