NXP Semiconductors SPC5517EAVMG80 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32B 1.5MB FLASH 208MAPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
SPC5517EAVMG80
Detailed Description
IC MCU 32B 1.5MB FLASH 208MAPBGA
Package
208-BGA
Key Features
Package / Case: 208-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
SPC5517EAVMG80 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors SPC5517EAVMG80 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
80K x 8
Package / Case
208-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
4.5V ~ 5.25V
Lifecycle Status
Active
Peripherals
DMA, POR, PWM, WDT
Number of I/O
111
Speed
66MHz
Core Processor
e200z0, e200z1
Alternate Parts Comparison (SPC5517EAVMG80 vs SPC5644AF0MMG2R vs SPC5644AF0MMG3 vs SPC5534MVM80)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 208-BGA | 208-BGA | 208-BGA | 208-BGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C | -40°C ~ 125°C (TA) |
| Supply Voltage | 4.5V ~ 5.25V | 1.14V ~ 5.25V | 1.14V ~ 1.32V | 1.35V ~ 1.65V |
| Core Processor | e200z0, e200z1 | e200z4 | e200z4 | e200z6 |
| Core Size | 32-Bit Dual-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
| RAM Size | 80K x 8 | 192K x 8 | 192K x 8 | 64K x 8 |
| Lifecycle Status | Active | Active | Active | Not For New Designs |
| Connectivity | CANbus, EBI/EMI, I²C, SCI, SPI | CANbus, EBI/EMI, LINbus, SCI, SPI | CANbus, EBI/EMI, LINbus, SCI, SPI | CANbus, EBI/EMI, Ethernet, SCI, SPI |
| Data Converters | A/D 40x12b | A/D 40x12b | A/D 40x12b | A/D 34x12b |
| Number of I/O | 111 | 120 | 120 | 192 |
| Oscillator Type | Internal | Internal | Internal | External |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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