NXP Semiconductors SC900841JVKR2 Power Management - Specialized
IC POWER MGT 338-MAPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
SC900841JVKR2
Detailed Description
IC POWER MGT 338-MAPBGA
Package
338-TFBGA
Key Features
Package / Case: 338-TFBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
SC900841JVKR2 Datasheet
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Technical Specifications
NXP Semiconductors SC900841JVKR2 Power Management - Specialized technical specifications.
General
Package / Case
338-TFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Applications
PC's, PDA's
Alternate Parts Comparison (SC900841JVKR2 vs SC511663MZP40 vs SC511660MZP40 vs SC5554MVR132)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 338-TFBGA | 272-BBGA | 272-BBGA | 416-BBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | -- | 2.5V ~ 2.7V | 2.5V ~ 2.7V | 1.35V ~ 1.65V |
| Core Processor | -- | PowerPC | PowerPC | e200z6 |
| Core Size | -- | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
| RAM Size | -- | 26K x 8 | 26K x 8 | 64K x 8 |
| Connectivity | -- | CANbus, EBI/EMI, SCI, SPI, UART/USART | CANbus, EBI/EMI, SCI, SPI, UART/USART | CANbus, EBI/EMI, SCI, SPI |
| Data Converters | -- | A/D 32x10b | A/D 32x10b | A/D 40x12b |
| Number of I/O | -- | 101 | 101 | 256 |
| Oscillator Type | -- | External | External | External |
| Peripherals | -- | POR, PWM, WDT | POR, PWM, WDT | DMA, POR, PWM, WDT |
| Action |
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