NXP Semiconductors S9S12XS256J0CAL,557 Microcontroller, Microprocessor, FPGA Modules
16 BIT MCU, S12X CORE, 256KB FLA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S9S12XS256J0CAL,557
Detailed Description
16 BIT MCU, S12X CORE, 256KB FLA
Package
112-LQFP
Key Features
Package / Case: 112-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
S9S12XS256J0CAL,557 Datasheet
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Technical Specifications
NXP Semiconductors S9S12XS256J0CAL,557 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
HCS12X
RAM Size
12K x 8
Package / Case
112-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.72V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
91
Speed
40MHz
Core Processor
HCS12X
Alternate Parts Comparison (S9S12XS256J0CAL,557 vs S912XEG128BCAL vs S912XEP100J4MAL vs MC9S12B128CPVE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 1.72V ~ 5.5V | 1.72V ~ 5.5V | 1.72V ~ 5.5V | 2.35V ~ 5.5V |
| Core Processor | HCS12X | HCS12X | HCS12X | HCS12 |
| Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
| RAM Size | 12K x 8 | 12K x 8 | 64K x 8 | 4K x 8 |
| Connectivity | CANbus, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, I²C, SCI, SPI |
| Data Converters | A/D 16x12b | A/D 16x12b | A/D 16x12b | A/D 16x10b |
| Number of I/O | 91 | 91 | 91 | 91 |
| Oscillator Type | External | External | External | Internal |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | POR, PWM, WDT |
| Action |
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