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NXP Semiconductors MC9S12B128CPVE Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 128KB FLASH 112LQFP

51,854NXP Semiconductors112-LQFPRoHS
MC9S12B128CPVE 112-LQFP package illustration

Same model may have multiple batches, images only for reference.

MC9S12B128CPVE
Manufacturer
Part Number (MPN)
MC9S12B128CPVE
Detailed Description
IC MCU 16BIT 128KB FLASH 112LQFP
Package
112-LQFP
Key Features
Package / Case: 112-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MC9S12B128CPVE Datasheet
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Technical Specifications

NXP Semiconductors MC9S12B128CPVE Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
4K x 8
RoHS
Yes
Package / Case
112-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.35V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
POR, PWM, WDT
Number of I/O
91
Speed
25MHz

Related Parts Comparison (MC9S12B128CPVE vs MC9S12XDT256MAL vs MC9S12KT256MPVE vs MC9S12XEP100CAL)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case112-LQFP112-LQFP112-LQFP112-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.35V ~ 5.5V2.35V ~ 5.5V2.35V ~ 5.5V1.72V ~ 5.5V
Core ProcessorHCS12HCS12XHCS12HCS12X
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size4K x 816K x 812K x 864K x 8
RoHSYesYesYesYes
Lifecycle StatusObsoleteActiveObsoleteActive
ConnectivityCANbus, I²C, SCI, SPICANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPICANbus, EBI/EMI, I²C, SCI, SPICANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Data ConvertersA/D 16x10bA/D 16x10bA/D 16x10bA/D 16x12b
EEPROM Size1K x 84K x 84K x 84K x 8
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