NXP Semiconductors MC9S12B128CPVE Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 128KB FLASH 112LQFP

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MC9S12B128CPVE
Detailed Description
IC MCU 16BIT 128KB FLASH 112LQFP
Package
112-LQFP
Key Features
Package / Case: 112-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
MC9S12B128CPVE Datasheet
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Technical Specifications
NXP Semiconductors MC9S12B128CPVE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
4K x 8
Package / Case
112-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.35V ~ 5.5V
Peripherals
POR, PWM, WDT
Number of I/O
91
Speed
25MHz
EEPROM Size
1K x 8
Core Processor
HCS12
Alternate Parts Comparison (MC9S12B128CPVE vs MC9S12XDT256MAL vs MC9S12KT256MPVE vs MC9S12XEP100CAL)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.35V ~ 5.5V | 2.35V ~ 5.5V | 2.35V ~ 5.5V | 1.72V ~ 5.5V |
| Core Processor | HCS12 | HCS12X | HCS12 | HCS12X |
| Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
| RAM Size | 4K x 8 | 16K x 8 | 12K x 8 | 64K x 8 |
| Connectivity | CANbus, I²C, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | CANbus, EBI/EMI, I²C, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI |
| Data Converters | A/D 16x10b | A/D 16x10b | A/D 16x10b | A/D 16x12b |
| EEPROM Size | 1K x 8 | 4K x 8 | 4K x 8 | 4K x 8 |
| Number of I/O | 91 | 91 | 91 | 91 |
| Oscillator Type | Internal | External | Internal | External |
| Action |
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