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NXP Semiconductors S9S12GN32J0CFT Microcontroller, Microprocessor, FPGA Modules

16-bit MCU, S12 core, 32KB Flash

1,763 ActiveNXP Semiconductors48-TFQFN Exposed PadRoHS
S9S12GN32J0CFT 48-TFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

S9S12GN32J0CFT
Manufacturer
Part Number (MPN)
S9S12GN32J0CFT
Detailed Description
16-bit MCU, S12 core, 32KB Flash
Package
48-TFQFN Exposed Pad
Key Features
Package / Case: 48-TFQFN Exposed Pad
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF S9S12GN32J0CFT Datasheet
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Technical Specifications

NXP Semiconductors S9S12GN32J0CFT Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
HCS12
RAM Size
2K x 8
Data Bus Width
16 bit
Maximum Clock Frequency
25 MHz
RoHS
Yes
Package / Case
48-TFQFN Exposed Pad
Mounting Type
SMD/SMT
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3.13V ~ 5.5V
Lifecycle Status
Active

Related Parts Comparison (S9S12GN32J0CFT vs S9S12GN32F0MFT vs S9S12GN32F0VFTR vs MC9S12P96VFT)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case48-TFQFN Exposed Pad48-TFQFN Exposed Pad48-TFQFN Exposed Pad48-TFQFN Exposed Pad
Mounting TypeSMD/SMTSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)
Supply Voltage3.13V ~ 5.5V3.13V ~ 5.5V3.13V ~ 5.5V1.72V ~ 5.5V
Core ProcessorS1212V112V1HCS12
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size2K x 82K x 82K x 86K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveObsolete
ConnectivityIrDA, LINbus, SCI, SPIIrDA, LINbus, SCI, SPIIrDA, LINbus, SCI, SPICANbus, SCI, SPI
Data ConvertersA/D 8x10bA/D 8x10bA/D 8x10bA/D 10x12b
EEPROM Size1K x 81K x 81K x 84K x 8
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