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NXP Semiconductors S9S12GN32F0VFTR Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 32KB FLASH 48QFN

16,800 ActiveNXP Semiconductors48-TFQFN Exposed PadRoHS
S9S12GN32F0VFTR 48-TFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

S9S12GN32F0VFTR
Manufacturer
Part Number (MPN)
S9S12GN32F0VFTR
Detailed Description
IC MCU 16BIT 32KB FLASH 48QFN
Package
48-TFQFN Exposed Pad
Key Features
Package / Case: 48-TFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF S9S12GN32F0VFTR Datasheet
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Technical Specifications

NXP Semiconductors S9S12GN32F0VFTR Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
RoHS
Yes
Package / Case
48-TFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3.13V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
40
Speed
25MHz

Alternate Parts Comparison (S9S12GN32F0VFTR vs S9S12GN32F0MFT vs MC9S12P96VFT vs S9S12P32J0VFT)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case48-TFQFN Exposed Pad48-TFQFN Exposed Pad48-TFQFN Exposed Pad48-TFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)
Supply Voltage3.13V ~ 5.5V3.13V ~ 5.5V1.72V ~ 5.5V1.72V ~ 5.5V
Core Processor12V112V1HCS12HCS12
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size2K x 82K x 86K x 82K x 8
ConnectivityIrDA, LINbus, SCI, SPIIrDA, LINbus, SCI, SPICANbus, SCI, SPICANbus, SCI, SPI
Data ConvertersA/D 8x10bA/D 8x10bA/D 10x12bA/D 10x12b
EEPROM Size1K x 81K x 84K x 84K x 8
Number of I/O40403434
Oscillator TypeInternalInternalInternalInternal
Action

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