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NXP Semiconductors S9S12GN32F1VTJ Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 32KB FLASH 20TSSOP

50,806 ActiveNXP Semiconductors20-TSSOP (0.173", 4.40mm Width)RoHS
S9S12GN32F1VTJ - No Image Available

Same model may have multiple batches, images only for reference.

S9S12GN32F1VTJ
Manufacturer
Part Number (MPN)
S9S12GN32F1VTJ
Detailed Description
IC MCU 16BIT 32KB FLASH 20TSSOP
Package
20-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 20-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF S9S12GN32F1VTJ Datasheet
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Technical Specifications

NXP Semiconductors S9S12GN32F1VTJ Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
Package / Case
20-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3.13V ~ 5.5V
Peripherals
LVD, POR, PWM, WDT
Number of I/O
14
Speed
25MHz
EEPROM Size
1K x 8
Core Processor
12V1

Alternate Parts Comparison (S9S12GN32F1VTJ vs P89LPC922FDH,512 vs S9S08SG32E1MTJR vs S9S08SG16E1MTJR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case20-TSSOP20-TSSOP20-TSSOP20-TSSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage3.13V ~ 5.5V2.4V ~ 3.6V2.7V ~ 5.5V2.7V ~ 5.5V
Core Processor12V18051S08S08
Core Size16-Bit8-Bit8-Bit8-Bit
RAM Size2K x 8256 x 81K x 81K x 8
ConnectivityIrDA, LINbus, SCI, SPII²C, UART/USARTI²C, LINbus, SCI, SPII²C, LINbus, SCI, SPI
Number of I/O14181616
Oscillator TypeInternalInternalInternalInternal
PeripheralsLVD, POR, PWM, WDTBrown-out Detect/Reset, LED, POR, PWM, WDTLVD, POR, PWM, WDTLVD, POR, PWM, WDT
Program Memory Size32KB (32K x 8)8KB (8K x 8)32KB (32K x 8)16KB (16K x 8)
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