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NXP Semiconductors S9S12GN32F1VTJ Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 32KB FLASH 20TSSOP

50,806 ActiveNXP Semiconductors20-TSSOP (0.173", 4.40mm Width)RoHS
S9S12GN32F1VTJ 20-TSSOP (0.173", 4.40mm Width) package illustration

Same model may have multiple batches, images only for reference.

S9S12GN32F1VTJ
Manufacturer
Part Number (MPN)
S9S12GN32F1VTJ
Detailed Description
IC MCU 16BIT 32KB FLASH 20TSSOP
Package
20-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 20-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF S9S12GN32F1VTJ Datasheet
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Technical Specifications

NXP Semiconductors S9S12GN32F1VTJ Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
2K x 8
RoHS
Yes
Package / Case
20-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3.13V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
14
Speed
25MHz

Related Parts Comparison (S9S12GN32F1VTJ vs P89LPC922FDH,512 vs S9S08SG32E1MTJR vs S9S08SG16E1MTJR)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case20-TSSOP20-TSSOP20-TSSOP20-TSSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage3.13V ~ 5.5V2.4V ~ 3.6V2.7V ~ 5.5V2.7V ~ 5.5V
Core Processor12V18051S08S08
Core Size16-Bit8-Bit8-Bit8-Bit
RAM Size2K x 8256 x 81K x 81K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveObsoleteActiveActive
ConnectivityIrDA, LINbus, SCI, SPII²C, UART/USARTI²C, LINbus, SCI, SPII²C, LINbus, SCI, SPI
Number of I/O14181616
Oscillator TypeInternalInternalInternalInternal
Action

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