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NXP Semiconductors P89LPC922FDH,512 Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 8KB FLASH 20TSSOP

27,388NXP Semiconductors20-TSSOP (0.173", 4.40mm Width)RoHS
P89LPC922FDH,512 - No Image Available

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P89LPC922FDH,512
Manufacturer
Part Number (MPN)
P89LPC922FDH,512
Detailed Description
IC MCU 8BIT 8KB FLASH 20TSSOP
Package
20-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 20-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF P89LPC922FDH,512 Datasheet
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Technical Specifications

NXP Semiconductors P89LPC922FDH,512 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
256 x 8
Package / Case
20-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.4V ~ 3.6V
Peripherals
Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O
18
Speed
18MHz
Core Processor
8051
Program Memory Type
Flash

Alternate Parts Comparison (P89LPC922FDH,512 vs S9S12GN32F1VTJ vs S9S08RNA16W2MTJ vs S9S08SL16F1MTJR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case20-TSSOP20-TSSOP20-TSSOP20-TSSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage2.4V ~ 3.6V3.13V ~ 5.5V2.7V ~ 5.5V2.7V ~ 5.5V
Core Processor805112V1S08S08
Core Size8-Bit16-Bit8-Bit8-Bit
RAM Size256 x 82K x 82K x 8512 x 8
ConnectivityI²C, UART/USARTIrDA, LINbus, SCI, SPII²C, LINbus, SPI, UART/USARTI²C, LINbus, SCI, SPI
Number of I/O18141616
Oscillator TypeInternalInternalInternalExternal
PeripheralsBrown-out Detect/Reset, LED, POR, PWM, WDTLVD, POR, PWM, WDTLVD, POR, PWM, WDTLVD, POR, PWM, WDT
Program Memory Size8KB (8K x 8)32KB (32K x 8)16KB (16K x 8)16KB (16K x 8)
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