NXP Semiconductors S9S08DZ60F2CLCR Microcontroller, Microprocessor, FPGA Modules
HCS08 S08 Microcontroller IC 8-Bit 40MHz 60KB (60K x 8) FLASH
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S9S08DZ60F2CLCR
Detailed Description
HCS08 S08 Microcontroller IC 8-Bit 40MHz 60KB (60K x 8) FLASH
Package
32-LQFP
Key Features
Package / Case: 32-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
Datasheet
S9S08DZ60F2CLCR Datasheet
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Technical Specifications
NXP Semiconductors S9S08DZ60F2CLCR Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
S08
RAM Size
4K x 8
Data Bus Width
8 bit
Maximum Clock Frequency
40 MHz
RoHS
Yes
Package / Case
32-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Alternate Parts Comparison (S9S08DZ60F2CLCR vs S9S12VR48AAVLCR vs MC9S08AC16CFJER vs MC9S08FL8CLC)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 32-LQFP | 32-LQFP | 32-LQFP | 32-LQFP |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 3.5V ~ 40V | 2.7V ~ 5.5V | 4.5V ~ 5.5V |
| Core Processor | HCS08 | HCS12 | S08 | S08 |
| Core Size | 8-Bit | 16-Bit | 8-Bit | 8-Bit |
| RAM Size | 4K x 8 | 2K x 8 | 1K x 8 | 768 x 8 |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active |
| Connectivity | CANbus, I²C, LINbus, SCI, SPI | IrDA, LINbus, SCI, SPI | I²C, SCI, SPI | SCI |
| Data Converters | A/D 10x12b | A/D 2x10b | A/D 6x10b | A/D 12x8b |
| Number of I/O | 26 | 16 | 22 | 30 |
| Oscillator Type | External | External, Internal | Internal | Internal |
| Action |
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